SUPER ARRI

事实上是英伟达已经被逼得开始减配了！ 英伟达下一代旗舰 SOCAMM/CPU 侧内存方案，被爆出从 192GB 砍到了 96GB。连带单机架 DRAM 总容量直接腰斩。 而一条完整的死亡传导链也已经浮现： Anthropic 烧不动 ➡️ 买方开始算 ROI ➡️ 英伟达被迫“降本保交付”（Rubin 砍内存、50系砍高显存型号） ➡️ 三星/海力士的“永远紧缺永远溢价”故事被证伪 ➡️ 高盛下调评级 ➡️ KOSPI 熔断。

Cbrs快到185的发行价格了 各位美股交易员，185能买吗？

“Korea China HBM Gap Narrows to Three Years” The Chinese government, in an effort to catch up with Korea’s dominance of the high bandwidth memory (HBM) market, has issued an “all out HBM mobilization order” to its domestic firms and launched an aggressive volume offensive, and as a result the HBM technology gap between Korea and China is understood to have narrowed to roughly three years. According to the semiconductor industry on the 1st, an analysis has emerged putting the HBM technology gap between Samsung Electronics (005930) and SK Hynix (000660) on one side and China’s Changxin Memory Technologies (CXMT) on the other at about three years. A senior industry official with deep knowledge of Chinese semiconductor companies said, “CXMT’s current HBM technology lags Samsung Electronics by two to three generations,” adding, “but CXMT has not given up on technology development and has pushed aggressively, rising to the level of Samsung Electronics’ and SK Hynix’s HBM3.” The Chinese government has recently been pressing CXMT strongly to sharply expand its HBM mass production capacity. Accordingly, CXMT has been aggressively building up its wafer production capacity, and its 12 inch wafer capacity is projected to reach around 300,000 units per month by year end. That amounts to 14% of global supply, a level that puts it shoulder to shoulder with America’s Micron. Until now, the semiconductor industry had viewed CXMT as having effectively abandoned development of HBM3, the fourth generation HBM, after hitting a technical wall, but it turns out that only the yield (the share of good product) is low while the technology itself has chased Korean HBM3 products right up to the chin. That said, with Samsung Electronics and SK Hynix already having entered mass production of the sixth generation HBM4, assessments have emerged that the technology gap with Korea can be seen as more than three years. Meanwhile, NVIDIA CEO Jensen Huang unveiled the company’s first PC AI chip, the “N1 X,” sending demand for Samsung Electronics’ and SK Hynix’s memory chips surging once again. In a keynote address at “GTC Taipei,” held that day at the Taipei Music Center, CEO Huang introduced the “NVIDIA RTX Spark” notebook lineup presented together with Microsoft (MS) and also unveiled the “N1 X.” The chip is reported to carry Samsung Electronics’ and SK Hynix’s high performance low power memory, LPDDR5X.