
David Lammers
74 posts

David Lammers
@dplammers
Working as a contributing writer at Semiconductor Digest.












GlobalFoundries and Arm Research demonstrate a 3D mesh interconnect design using highly-dense hybrid bonding 3D stacking technology intended for HPC applications. #3DIC #12nm #HybridBonding @Arm @GLOBALFOUNDRIES #3DStacking fuse.wikichip.org/news/2680/glob…




I stand before you as the granddaughter of an iron ore miner, the daughter of a teacher and a newspaperman, the first woman elected to the United States Senate from the State of Minnesota, to announce my candidacy for President of the United States.





Intel discloses MRAM for 22FFL. It's now production ready. Embedding MRAM does not affect device/interconnect performance. 216nmx225nm cell. 180% TMR (p/ap). 10e7 cycles endurance, 10y retention @ >210C. #IEDM2018





