
Applied Materials is proud to announce a long-term collaboration agreement with @SKhynix to accelerate the development and deployment of next-generation DRAM and high-bandwidth memory (HBM). Engineers from both companies will work side-by-side at Applied’s EPIC Center in Silicon Valley to advance innovation in materials, process integration and 3D advanced packaging as memory architectures move beyond current production nodes.
President and CEO Gary Dickerson shared, “Applied Materials and SK hynix share a long history of working together to improve the energy-efficient performance of advanced memory chips through innovations in materials engineering,” He added, “We are excited to have SK hynix join the EPIC Center as a founding partner, and we look forward to driving further breakthroughs together that accelerate commercialization of next-generation DRAM and HBM technologies for the AI era.”
Learn more: bit.ly/4rpcuB0

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