E&IT Department Odisha

Two national firsts. Both in Odisha. 🇮🇳 ✅️ India's 1st Compound Semiconductor Fab ✅️ India's 1st Advanced 3D Chip Packaging Unit

The Maitri Platform envisions equitable access to compute, datasets & models moving beyond costly private access and solely government-led systems toward a more inclusive digital future. #DigitalIndia #AIforAll #ResponsibleAI @SecretaryMEITY

India is making AI more accessible for the world Under the IndiaAI Mission: • AI compute costs drop to ~1/3 of the market price • Boosting global access to AI technologies • Empowering innovation across the Global South @OfficialINDIAai #DigitalIndia #AIForAll

India's very first Carbon Thread Glass Substrate Packaging Facility – right here in Odisha! Global giants like Intel, Lockheed Martin, and Applied Materials have partnered for 3D Glass Solutions. #OdishaSemicon #IndiaSemiconductorMission @SemiconIndia

The India Semiconductor Mission's latest project introduces India's first commercial-scale advanced packaging tech—pioneering innovation and true self-reliance. #IndiaSemiconductorMission #DigitalIndia #Semiconductor @SemiconIndia

CM Mohan Charan Majhi on Odisha's game-changing 3D semiconductor unit: Fueling AI, defence & more for PM Modi's self-reliance dream! @AshwiniVaishnaw #Semiconindia #PMModi

CM Mohan Charan Majhi and Union Minister Ashwini Vaishnaw have set the stage for Odisha to become a global destination for tech giants like Intel and Lockheed Martin. @AshwiniVaishnaw #Semiconindia #PMModi

Discussions are underway with Intel for giving Odisha top priority in investments.

From Odisha, for the world… Powering the next wave of semiconductor innovation! 🌎

✅Stipends for students ✅ Stronger skills A future-ready semiconductor workforce in Odisha.

"ବିଶ୍ୱ ସେମିକଣ୍ଡକ୍ଟର ଶିଳ୍ପ ପାଇଁ ଓଡ଼ିଶା ଏକ ଆଦର୍ଶ ଗନ୍ତବ୍ୟସ୍ଥଳୀ ଭାବେ ଉଭୁକ୍ତ ହୋଇଛି। ଆମ ପାଖରେ ସମ୍ବଳ ଅଛି, ପ୍ରତିଭା ଅଛି, ଭିତ୍ତିଭୂମି ଅଛି, ସଂକଳ୍ପ ଅଛି। ଆଗାମୀ ଦିନର ଟେକ୍ନୋଲୋଜି ଗଢ଼ିବାକୁ ଚାହୁଁଥିଲେ—Odisha is your destination.”:- ମାନ୍ୟବର ମୁଖ୍ୟମନ୍ତ୍ରୀ

ଆଜିର ଦିନ କେବଳ ଓଡ଼ିଶା ପାଇଁ ନୁହେଁ, ଭାରତର ଟେକ୍ନୋଲୋଜିକାଲ ଲିଡରସିପ୍ ଯାତ୍ରା ପାଇଁ ଏକ ସ୍ମରଣୀୟ ମୁହୂର୍ତ୍ତ। ଏହି ପ୍ରକଳ୍ପ ଦେଶରେ ପ୍ରଥମ ଥର ପାଇଁ ଏକ ଆଡଭାନ୍ସଡ୍ 3D ଗ୍ଲାସ୍ ସବ୍‌ଷ୍ଟ୍ରେଟ୍ ପ୍ୟାକେଜିଂ ସୁବିଧା ସୃଷ୍ଟି କରିବ। ଏହି ୟୁନିଟ୍‌ରେ ଉତ୍ପାଦିତ କମ୍ପୋନେଣ୍ଟଗୁଡ଼ିକ ଆର୍ଟିଫିସିଆଲ୍ ଇଣ୍ଟେଲିଜେନ୍ସ, ହାଇ ପର୍ଫର୍ମାନ୍ସ କମ୍ପ୍ୟୁଟିଂ ଓ ପ୍ରତିରକ୍ଷା ଇଲେକ୍ଟ୍ରୋନିକ୍ସ ଭଳି ବିକାଶଶୀଳ କ୍ଷେତ୍ରରେ ଗୁରୁତ୍ୱ ଅର୍ଜନ କରିବ ବୋଲି ମାନ୍ୟବର ମୁଖ୍ୟମନ୍ତ୍ରୀ ଏହି ଅବସରରେ କହିଛନ୍ତି। ପୂର୍ବ ଭାରତରେ ଓଡ଼ିଶା ଆତ୍ମନିର୍ଭର ଭାରତର ଲଞ୍ଚପ୍ୟାଡ୍ ହେବ। ପ୍ରାୟ ୨ ହଜାର କୋଟି ଟଙ୍କା ନିବେଶରେ ସ୍ଥାପିତ ହେଉଥିବା ଏହି ପ୍ରକଳ୍ପ ବର୍ଷକୁ ୭୦ ହଜାର ଗ୍ଲାସ୍ ପ୍ୟାନେଲ, ୫୦ ମିଲିୟନ ଆସେମ୍ବଲ୍ଡ ୟୁନିଟ୍ ଏବଂ ୧୩,୨୦୦ ଅତ୍ୟାଧୁନିକ 3DHI ମଡ୍ୟୁଲ୍ ଉତ୍ପାଦନ କରିବ। ଏହା ଦ୍ୱାରା ରାଜ୍ୟରେ ପ୍ରାୟ ୨,୫୦୦ ନିଯୁକ୍ତି ସୃଷ୍ଟି ହେବ। ଏହା ଓଡ଼ିଶାର ଛାତ୍ରଛାତ୍ରୀ ଓ ଇଞ୍ଜିନିୟରମାନଙ୍କ ପାଇଁ ସୁବର୍ଣ୍ଣ ସୁଯୋଗର ସମୟ। ସେମାନେ ନିଜକୁ ଦକ୍ଷ କରି ଏହି ଉଦୟମାନ କ୍ଷେତ୍ରରେ ଅଗ୍ରସର ହେବାକୁ ମାନ୍ୟବର ମୁଖ୍ୟମନ୍ତ୍ରୀ ଆହ୍ୱାନ କରିଛନ୍ତି। @PMOIndia

"For the global semiconductor industry, our message is clear: We have power We have talent We have infrastructure We have resolve If you are looking for the right place to build the technologies of tomorrow- Odisha is your destination." - Hon'ble CM Shri Mohan Charan Majhi

This facility will generate thousands of quality jobs for our youth and anchor a thriving ecosystem of testing laboratories and ancillary industries, accelerating Odisha's transformation from a mineral-driven economy to a mind-driven one, where the brilliance of Odia talent meets world-class infrastructure. To the global technology industry, our message is clear: with abundant power, a skilled workforce, and an unwavering commitment to progress, Odisha is India's ultimate destination for advanced electronics and a truly Atmanirbhar Bharat.

Odisha breaks ground of India's 1st 3D Glass Chip Packaging Unit at speed with faster approvals. 🇮🇳 Chips for the world will be packaged with most advanced technology from Odisha.

Odisha is ready to break ground on India's 1st Advanced 3D Glass Chip Packaging Unit. 🇮🇳 WATCH LIVE: youtu.be/uU-WeFK6n2Y

📍Infovalley, Bhubaneswar, Odisha Ground Zero of India's 1st Advanced Glass Chip Packaging Unit. 🇮🇳

ଆଜି ଭୁବନେଶ୍ୱରରେ ଭାରତର ପ୍ରଥମ Advanced 3D Chip Packaging Unit ର ଭିତ୍ତିପ୍ରସ୍ତର ସ୍ଥାପନ କରାଯିବ। ଏହି ପ୍ରକଳ୍ପ ଓଡ଼ିଶାର ପ୍ରଯୁକ୍ତିବିଦ୍ୟା କ୍ଷେତ୍ରର ବିକାଶ, ନିଯୁକ୍ତି ସୁଯୋଗ ସୃଷ୍ଟି ସହ ବିକଶିତ ଭାରତ ଗଠନର ସ୍ଵପ୍ନକୁ ସାକାର କରିବ। @GoI_MeitY

Odisha's industrial landscape is evolving rapidly, no longer anchored solely to traditional sectors, but boldly embracing technology, innovation, and high-value manufacturing. Today marks a landmark moment as we break ground on India's first Advanced 3D Glass Chip Packaging Unit. This visionary project will unlock significant employment opportunities and firmly establish Odisha as a serious force in advanced electronics manufacturing. Driven by the visionary leadership of Hon'ble Prime Minister Shri @narendramodi Ji and the guidance of Hon'ble Union Minister of Electronics and Information Technology Shri @AshwiniVaishnaw Ji, and the promise of the Purvodaya vision, Odisha is charting a decisive course toward becoming a hub for next-generation industries, contributing powerfully to the dream of an Atmanirbhar Bharat.

Hon’ble Chief Minister Shri @MohanMOdisha will preside over the Groundbreaking Ceremony of the Heterogenous Integration Packaging Solutions (3DGS) project in #Bhubaneswar. In the august presence of Hon'ble Union Minister Shri @AshwiniVaishnaw and Hon'ble E&IT Minister Dr @MahalingMukesh, this landmark initiative marks a major leap in #Odisha’s semiconductor ecosystem, with an investment of ₹1,944 crore. @PMOIndia