Semiconductor Engineering

Latest: US AI framework; GPU smuggling; HBM4; war’s impact on supply chain; GTC; restart of H200; memory prediction; TFLN photonics; test/metrology platforms; NoC verification automation; AI distillation attacks; high-NA EUV... semiengineering.com/chip-industry-… #semiconductor #GPUs #AI

Chips that didn’t need cooling may require it now. semiengineering.com/liquid-cooling… #semiconductor #liquidcooling #heatsinks #immersioncooling #microcooling

Why new LPDDR releases make them the memories of choice for many applications. With memory expert Steve Woo, Rambus fellow and distinguished inventor semiengineering.com/memory-for-ai-… #LPDDR #DRAM #AIDataCenters @rambusinc #inferencing #GDDR

For reaching farther into another data center, developers are now talking about scale-across. semiengineering.com/scale-up-scale… #AIdatacenters #scaleacross #AIworkloads #Ethernet #scaleup #scaleout

While it’s not inherently low power, CPO offers extremely low energy consumption per transmitted bit — a crucial metric for data center efficiency. semiengineering.com/cpo-is-extendi… #CPO #copackagedoptics #datacenters #AIdatacenters

Architecting solutions for edge AI is not about minimizing cloud solutions or making small extensions of existing MCUs/MPUs. It’s a HW/SW/model co-development problem. semiengineering.com/ai-power-on-th… #lowpower #EdgeAI #codesign #semiconductor #semiEDA

Latest news: Preparing for sub-1nm; Iran war fallout on chips; AI chips; Embedded World; ramping Japan; foundry rankings; MIPI PHY IP; clocking; cybersecurity; imec’s new consortium; neuromorphic computing... semiengineering.com/chip-industry-… #semiconductor #AIchips #EdgeAI #semiEDA #CPO

Yield loss is increasingly molecular in origin and invisible to conventional inspection. semiengineering.com/detecting-chem… #semiconductor #defects #yield

Chip industry leverages massive compute resources and AI for virtual sandboxes. semiengineering.com/digital-twins-… #digitaltwins #AI #SemiconductorTest #DFT #SLM #virtualtwins

New techniques are needed to keep pace with ever-shrinking features and tolerances. semiengineering.com/tool-matching-… #semiconductor

OEMs are driving faster design cycles and enhanced security amid evolving vehicle architectures and compliance requirements. semiengineering.com/auto-security-… #automotive #cybersecurity #ISO21434

New technical papers recently added to Semiconductor Engineering’s library semiengineering.com/chip-industry-… #semiconductor #GPU #AIaccelerators #OxideSemiconductors #Edge #RPU #AIhardware #IMC

Latest: AI integrity attacks; bid for Rohm; US weighs more AI chip authority; on-chip security controls; MWC; interconnect deals; CPO; 18A; lithography; domain-scoped agentic AI; HBM4; 9-minute EV charge; AI chip design.. semiengineering.com/chip-industry-… #semiconductor #tech #MWC26 #HBM

The future of semiconductor manufacturing is no longer dependent just on shrinking features. Instead, chipmakers are rethinking how devices are built, stacked, and powered. semiengineering.com/making-hybrid-… #hybridbonding #semiconductor #HBM #advancedpackaging

Exponential increases in data and a mix of performance requirements are driving a top-to-bottom rethinking of what works best where. semiengineering.com/new-automotive… #automotive #ADAS #LPDDR6 #SDVs