Open Compute Project

JUST ANNOUNCED: Women in OCP (WOCP) Empower Hour: A Day in the Life of Women in Technology Wednesday, March 25, 2026 Time: 1:00 PM Eastern | 12:00 PM Central | 11:00 AM Mountain | 10:00 AM Pacific Celebrate International Women’s Day and International Data Center Day with an interactive session spotlighting the women shaping our digital infrastructure. Join us to hear the "day in the life" stories, challenges, and triumphs of women within the OCP community. Featured Speakers: · Nitza Basoco, Mobility Business Unit Manager | Head of US Startups & Ecosystem Partnerships - Teradyne, Inc · Allison Boen, President & Immersion Cooling Consultant - Alcatex · Shruti Sethi, Senior Product Manager - Microsoft What to expect: · A behind-the-scenes look at real-world roles in tech and data centers · Personal journeys into the industry — what sparked their interest and how they got started · Career growth stories, lessons learned, and candid advice · Insights for women interested in exploring or advancing in technology and infrastructure careers · Interactive discussion and live audience Q&A Insights for women interested in exploring or advancing in technology and infrastructure careers Interactive discussion and live audience Q&A Join us to celebrate the resilience and impact of women in our industry. All are welcome! Registration is required to receive the Zoom information to join the event. REGISTER TODAY: bit.ly/4luKLNW Share this with your colleagues and subscribe to the WOCP mailing list for future updates here: bit.ly/40ue8q6

It was great to see the OCP Power Distribution subproject leaders, who have worked together for months, come together in-person for the first time at the recent UL Power Summit! The team presented their progress on the soon to be published OCP Power Distribution Whitepaper. Paolo and Antonello also actively participated remotely, highlighting the global collaboration driving this important project forward. Thank you to UL for hosting this productive meeting as we continue advancing the development of the power infrastructure required to support the next generation of IT hardware. Join the OCP Community to help make this vision a reality. Pictured: L to R JP Buzzell (Eaton), Brian Deckard (Siemens), Ken Boyce (UL), Lisa Grams (UL), Jing Wang (Google), Tony Landry (Schneider), Laurens Mackay (DC Opportunities) Project: opencompute.org/projects/power…

The full schedule is now live for the 2026 OCP EMEA Summit, taking place in Barcelona, Spain April 29 – 30. Keynotes this year will feature an update from the OCP Foundation on how the Community is advancing the OCP ecosystem vision, and panel discussions on scaling AI clusters and direct current powering of the datacenter to meet IT demands. There will also be an exciting lineup of talks from AMD, Arm, Broadcom, Google, Intel, Meta, Microsoft, NVIDIA, Rittal and Schneider Electric. This year there will be more than 350 sessions across 12 breakout session tracks, including 20+ panel discussions, plus the Future Technologies Symposium See the full schedule and register now at the lowest rate of just $450 USD + VAT: bit.ly/4b4PpyM

The OCP ESUN 1.0 Specification has been released! The OCP Ethernet for Scale-Up Networking (ESUN) initiative has launched its first major specification for AI infrastructure: the "OCP ESUN - Network Operator Requirements - Base Specification 1.0." This release comes just four months after we kicked off ESUN at the 2025 OCP Global Summit. ESUN is focused on enabling Ethernet to be the basis of high-performance scale-up networks inside the latest AI systems. Larger and more performant scale-up networks can greatly accelerate the latest AI jobs, such as distributed inference workloads and agentic workflows. Read the full story, see the spec and get involved here: bit.ly/4umBV94

Get ready for the 2026 OCP Canada Tech Day Taking place June 10-11 at the Le Westin Montreal, the 2026 OCP Canada Tech Day features talks from experts researching and designing the next generation of data center and edge computing equipment. The full-day workshop includes: · Insightful keynotes in the morning · Three Interactive Breakout Sessions in the afternoon · Data Center Integration of Quantum information Infrastructure · Open Systems for AI Clusters · The AI Computing Continuum · A networking social hour Discounted group rate at the Westin: 329 CAD Deadline to book at group rate: May 15, 2026 Click here to register and reserve your room: bit.ly/4szmh8F

We are pleased to announce that registration is now open for OCP's 7th annual Virtual Storage Summit. During this event, we will cover the latest in cutting-edge storage innovations. When: Wednesday, May 13, 2026 8:00 AM - 12:00 PM PDT Where: Zoom Virtual Event Topics to be discussed: · OCP L.O.C.K · Linux I/O · SNIA/SFF · OCP Storage Spec Updates · Fleet Health, Telemetry and Monitoring · Multi-VM environments, Live Migration, Virtualization · Perspectives from hyperscale's, SSD suppliers · And more! All are welcome but registration is required to receive the Zoom information. Register Today to Join Us: bit.ly/4rgB7Qe And thank you to our sponsors!

The keynotes for the 2026 OCP EMEA Summit are set! The 2026 OCP EMEA Summit, taking place in Barcelona, Spain April 29 – 30, serves as a platform where global technical leaders come together to tackle the issues related to data center sustainability, energy efficiency and heat reuse in the region. The focus is on exploring how innovations from hyperscale data center operators can contribute to solving these challenges. The OCP EMEA Summit also highlights deployments of specific OCP-recognized data center equipment in the EMEA region. Keynotes this year will feature an update from the OCP Foundation on how the Community is advancing the OCP ecosystem vision, and panel discussions on scaling AI clusters and direct current powering of the datacenter to meet IT demands. There will also be an exciting lineup of talks from AMD, Arm, Broadcom, Google, Intel, Meta, Microsoft, NVIDIA, Rittal and Schneider Electric. Check out this amazing lineup in detail, and register here: bit.ly/4rfFT0t

OCP is pleased to announce the launch of an AI Enabled O-RU OCP Experience Center hosted by UNH Interoperability Labs, in partnership with Lattice Semiconductor, that will give the OCP Community access to FPGA development platforms and toolchains for prototyping next-generation 5G/6G radio units with embedded AI capabilities. The facility will support the development, integration, and validation of AI-native wireless access components within an open ecosystem, supporting remote collaboration on hardware acceleration, firmware optimization, and AI-driven signal processing workflows. This work directly supports the goals and scope of the OCP AI Computing Continuum Project, extending AI infrastructure to the far edge and enabling interoperable, open, and scalable compute architectures across the full continuum from core data centers to edge and RAN deployments. Learn more at the OCP Marketplace here: bit.ly/4l1Qmee

Sponsor and exhibit sales will close this Wednesday, March 4 for the upcoming 2026 OCP EMEA Summit, taking place 29-30, April in beautiful Barcelona, Spain. And registration is open – register now at the lowest rate of just $450 USD + VAT. Everything you need can be found here: bit.ly/4b4DSQj

Don’t miss Data Centre World next week in London! Date: March 4 - 6, 2026 OCP Will be giving a presentation on Powering the One Mega-Watt Rack Data Center Date & Time: 4th March at 11:05 - 11:30 Location: Energy Efficiency Theatre Speakers: Cliff Grossner, Ph.D., Chief Innovation Officer, OCP Foundation Raúl Álvarez, European Market Development Manager, OCP Foundation Driven by the AI revolution, the data center construction boom is now a major economic force. This is injecting hundreds of billions of dollars directly into the economy for construction, specialized labor, and the procurement of IT hardware. This scale of investment necessitates a fundamental, strategic evolution in data center design to meet economic and technical realities. The issue faced by data center partners including hyperscale and neocloud data center operators, co-location providers, enterprise users, and technology providers is that siloed efforts produce competing design requirements that slows innovations and extends deployment timelines. To achieve economic efficiencies standardizations are needed to enable late-binding decisions, such as deploying GPUs or other AI accelerators within a given data center facility. This talk will discuss the latest open innovations being worked by the OCP Community on key data center infrastructure challenges: power, cooling, mechanical, and management telemetry. Come visit us at Booth J90. Learn more and register here: bit.ly/4cfvXQP Your registration includes access to Cloud & AI Infrastructure, Cloud & Cyber Security Expo, Big Data & AI World and DevOps Live - five connected events shaping the future of the digital economy.

OCP Open Chiplet Economy is Leading the Next Wave of AI: Inference Arm-Led Foundational Chiplet System Architecture Specification is Now Available OCP Today announced the release of Arm Led Foundational Chiplet System Architecture Specification (FCSA). FCSA will play on important role in enabling standardized chips that fit everywhere for silicon diversity, which will be imperative for the next wave of AI focused on optimizing AI inference at points-of-presence near the user, and in regional and hyperscale cloud data centers The Foundation Chiplet System Architecture (FCSA), a vendor-neutral specification derived from Arm Chiplet System Architecture (CSA). FCA establishes a common baseline for partitioning monolithic systems into interoperable Chiplets, enabling use across any processor architecture, including memory, I/O, and accelerators. Enabling a combination of low-cost chips that meet the needs of particular environments, applications, and pave the way to success. Read the full story here: bit.ly/4auJqkY

Sponsorship sales for the 2026 OCP APAC Summit in Taipei City, Taiwan are OPEN and filling up fast! Spots are reserved on a first-come, first-served basis by signed contract date. Building on the enormous success of last year’s event, OCP is once again bringing together APAC communities for a very special two-day, in-person Summit to explore many challenges and opportunities facing data center infrastructure, today and tomorrow. The OCP APAC Summit will showcase the latest innovations and technical advancements from around the world, and feature talks from experts who are researching, designing, building and running the next generation of hyperscale data center facilities and infrastructure. The Expo Hall will bring together buyers and sellers from the entire ecosystem and supply chain. Sponsorship deadline is May 1, 2026. Visit the event page here for all the details: bit.ly/4tLQi6H

IOWN Global Forum and Open Compute Project Join Forces to Deliver on the Next Wave of AI. The new AI Computing Continuum initiative will deliver an open, interoperable, and scalable infrastructure extending AI from centralized data center to the user. Read the full story here: businesswire.com/news/home/2026… Join the project and get involved here: opencompute.org/projects/aicc

The OCP Academy is the new home for free online learning in the OCP Community. Courses cover a wide range of data center technologies, including a 9-course series on chiplets. This series explores how chiplet-based design is revolutionizing semiconductor systems, promising cheaper products, lower unit costs, and faster time to market. Learn about the technologies, opportunities, and challenges for a successful Open Chiplet Economy in these easy 10-minute courses. Find all the courses at academy.opencompute.org Dig in deeper by attending the upcoming Chiplet Summit, taking place February 17 – 19, 2026 in Santa Clara, CA. OCP will be in booth 500 as well as host a pre-conference tutorial titled: Open Ecosystems for the Next Stage of Developing the Open Chiplet Economy on Tuesday, February 17. Register for free by using code: CS26OCP. Learn more and register for the event here: bit.ly/3ZwDnH

Important deadlines for the upcoming 2026 OCP EMEA Summit in Barcelona, Spain are coming up fast! Register now at the lowest rate of just $350 USD + VAT before prices go up after Friday, February 6. The Call for Presentations for the breakout sessions and the Future Technologies Symposium will close February 9, 2026 at 11:59 PM PST. And the Call for Submissions for the Innovation Village close February 13. Everything you need can be found here: bit.ly/4qUbx48

There is just ONE MONTH to go until Data Centre World! Be part of one of the world’s leading data centre events on 4-5 March at Excel London: forms.reg.buzz/data-centre-wo… Why you can’t miss it: 🎤 Hear from a world-class speaker lineup including Helen Munro, Head of Environment and Sustainability from Pulsant Data Centres, Cliff Grossner, Chief Innovation Officer from OCP, Astrid Wynne, Head of Sustainability, AI and Automation from Techbuyer and so much more! 🤝Meet 400+ industry giants including ABB, Vertiv, Siemens, Schneider Electric, Legrand, Eaton and many more! 💬 Connect with 17,000+ data centre leaders, professionals and enthusiasts from across the globe. If you’re responsible for data centre operations, infrastructure resilience, or sustainable capacity, this is where conversations shaping the future of digital infrastructure happen. Don’t miss your chance to connect, learn, and thrive. #TechShowLondon #DataCentreWorld

OCP Foundation Becomes First Sponsor of the iMasons AI Incubator Program Infrastructure Masons (iMasons) announced this week that the OCP Foundation has become the first official sponsor of the new iMasons AI Incubator, an initiative designed to give college and university students access to advanced AI tools, industry mentorship, and real-world digital infrastructure projects. OCP’s contribution enables the launch of the first student capstone project, led by student ambassador Jean Park from NYU, as well as state level hackathons starting in Texas in the first quarter of 2026. The iMasons AI Incubator platform is fully powered by second-life OCP hardware. The incubator was developed by iMasons to bridge the industry’s growing talent gap as senior engineers retire over the coming decades. The program provides applied experience using open hardware platforms and modern AI workflows—introducing emerging talent to OCP-recognized solutions early in their careers, a key benefit for OCP and its Community. OCP is challenging its member companies to match this sponsorship. You can learn more at the link below or email incubator@imasons.org. Read the full story here bit.ly/4qh37CP

Don’t miss the 2026 OCP APAC Summit in Taipei City, Taiwan August 11–12, 2026. The Open Compute Project (OCP) is bringing together APAC communities for a very special two-day, in-person Summit to explore the many challenges and opportunities facing data center infrastructure, today and tomorrow. The OCP APAC Summit will showcase the latest innovations and technical advancements from around the world, and feature talks from experts who are researching, designing, building and running the next generation of hyperscale data center facilities and infrastructure. The Expo Hall will bring together buyers and sellers from the entire ecosystem and supply chain. Sponsorships for the 2026 APAC Summit are still open but filling up! Registration and the Call for Presentations for the 2026 OCP APAC Summit will open at the beginning of April. Click here to visit the event page, access the sponsor prospectus, and learn more! bit.ly/4k22QlR And a big thank you to our sponsors!

UL Solutions and the Open Compute Project to Help Advance Safety and Scalability in New AI Data Center Innovations In collaboration with ABB and Eaton, this initiative will help drive innovation in AI data center design by mapping and enhancing the advanced safety standards applicable to next-generation power infrastructure. Read the full story here: bit.ly/45w0XI7

Join us at the 2026 Chiplet Summit! The 2026 Chiplet Summit will be taking place February 17 - 19, 2026 in Santa Clara, CA The event will feature keynote Addresses from Industry Leaders, including Synopsys, Alphawave Semi, Siemens, UCIe Consortium, Cadence, Arm, Open Compute Project, and Marvell. 2026’s Main Topics Include AI/ML Acceleration, Open Chiplet Economy, Advanced Packaging Methods, Die-to-die Interfaces, Working with Foundries. OCP will be in booth 500 as well as host a pre-conference tutorial titled: Open Ecosystems for the Next Stage of Developing the Open Chiplet Economy on Tuesday, February 17. The next wave of AI is focused on optimizing AI inference at points-of-presence near the user, and in regional and hyperscale cloud data centers. Making this happen quickly and cheaply, requires standardized chips that fit everywhere for silicon diversity. The key to quickly developing low-cost ecosystems will be standards enabling an interoperable chiplet-based open ecosystem. Allowing a combination of low-cost chips that meet the needs of particular environments, applications, and pave the way to success. For 2026, this is a main focus for OCP’s Open Chiplet Economy Project. Your speakers will be Anu Ramamurthy, Associate Fellow Research, Microchip, OCP Project Co-lead and Cliff Grossner, Ph.D. Chief Innovation Officer, Open Compute Project. Learn more and register at the event page here: bit.ly/3ZwDnHw