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Advanced packaging is one of the most important developments in modern semiconductors. As the effect of Moore's law becomes more pronounced and traditional transistor scaling slows, the next domain to improve performance is by stacking chips vertically and integrating them more tightly through advanced packaging.
3D-packaging provides for multiple benefits including shorter signal paths, lower latency, higher bandwidth and better energy efficiency.
"Everything is going 3D. This increases the importance of material science". - Applied Materials President.
At @BluehillVC, we are investing across the semiconductor value chain, including in the material science part of the value chain.

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