Cavad
4.8K posts

Cavad
@Cavad_b
wtf this processor so 🤏
under the silicone Katılım Mart 2023
24 Takip Edilen281 Takipçiler

@luancastro_lc Only for anti aliasing. For all I can say, it can't maintain 60fps with lowest settings at 720p on the 7s Gen 4.
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@luancastro_lc @Cavad_b Probably 18 to 20 watt
This is a theoritical Score
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I see a few models missing
I guess we shall not remeber 808 and 810 models
Snapdragon@Snapdragon
Year after year—more power, more performance, more possibility. And more to come with @Samsungmobile. Explore the latest devices: bit.ly/4cMK52G
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@Cavad_b 10 cores and yet 1000 lower multicore scores compared to SD 8 Elite Gen 5 with 8 cores! (12500+ peak multi)
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@Cavad_b cope cope cope
10core cpu matching 8cores
lol
that too on gaa 2nm with hpb
lol
cope!!!
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Cavad retweetledi

@SPYGO19726 @NasiLemakTech E2600 has the smallest P-core and a much lower clock speed compared to the others, which is why it can’t go more higher than 10-11k points. hoping the E2700 will be even more efficient and powerful
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@Cavad_b @NasiLemakTech The funny thing is 0 to 10k range is shown as small while the last useless 2k aka 10k to 12k is inflated for dramatic purpose
Even then the sustained max TDP of 2600 is 3 watts less.
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Cavad retweetledi
Cavad retweetledi
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XRING O3 clocks 4.05 GHz, drops big core cluster.
- Radical 3-cluster design: Prime + Titanium + Little
- Little core up to 3.02 GHz; GPU ~1.5 GHz, +25%
- DRAM unchanged at 9600 MT/s
- China-exclusive; foldable MIX Fold 5 tipped ~$1,500 🤖
ift.tt/7lcxQXv
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Cavad retweetledi

Exynos 2600 Geekbench 6 MT and Steel Nomad Lite power curve by AAA魅魔荧师傅 (Bilibili)
I don't typically add my commentary, but WHAT black magic did Samsung LSI do for E2600 to be more efficient than Snapdragon and Mediatek?
b23.tv/9dmJfgC


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Cavad retweetledi

Exynos 2600
C1U : 2.395mm² (no L2), 3.5mm² (with L2)
C1P : 0.963mm² (no L2), 1.3mm2 C1P Low Clock, 1.35mm² C1P High Clock
1WGP : 2.726mm²
GPU complex : 31.41mm²
CPU complex : 27.95mm²
NPU complex : 15.77mm²
NPU core : 1.59mm²
16MB SLC + tags : 8.485mm²
LPDDR5X PHY : 1.06mm² x 4

Chipwise@chipwise_tech
Die shot analysis of the Samsung Exynos 2600 💡🔍chipwise.tech/our-portfolio/…

S25+ peak (18-19w) vs s26 peak
3328 / 3.80gHz ≈ 876 PPC
3323 / 4.47gHz ≈ 743 PPC




Cavad@Cavad_b
E2600 now seems worth buying
Čeština
Cavad retweetledi

[EXCLUSIVE] Qualcomm CEO Visits Korea, Meets with Samsung Foundry Leadership… Memory Cooperation Talks with SK
Qualcomm CEO Cristiano Amon visited Korea on the 21st for back-to-back meetings with Samsung Electronics and SK Hynix executives. The visit is seen as an effort to concretize cooperation on the cutting-edge 2nm (nanometer; 1nm = one billionth of a meter) foundry process and to address memory supply-demand tightness that has intensified with the spread of artificial intelligence (AI).
Amon met exclusively with The Korea Economic Daily at a hotel in Banpo-dong, Seoul, earlier that day. Having entered the country via Gimpo Airport the previous day, he is carrying out his Korea trip schedule through today. Dressed in a blue shirt and tie, Amon exited the hotel without responding to reporters' questions.
The central agenda of Amon's visit is cooperation with Samsung Foundry. On this day, Amon is meeting with Samsung Electronics Foundry Business Division President Han Jin-man and other foundry executives. The two sides are expected to discuss producing Qualcomm's next-generation application processor (AP), the Snapdragon 8 Elite 2, on Samsung Electronics' 2nm process (SF2). At CES 2026 in January, Amon stated, "We have begun discussions with Samsung Electronics on utilizing the 2nm process for foundry production, and design work has been completed."
If a contract is signed, it would mark the return of Qualcomm's cutting-edge volume to Samsung after five years, having shifted to TSMC in 2022. Industry analysts attribute Qualcomm's renewed interest in Samsung Foundry to the latter having restored technological credibility by resolving its chronic yield and thermal issues. Samsung Electronics' July 2024 win of a $16.5 billion (approx. KRW 24 trillion) order from Tesla for production of the next-generation AI chip AI6 also contributed to the improved perception of its technological capabilities. Analysts also view the move as a strategic diversification, as TSMC's wafer prices continue to rise, pushing Qualcomm to dual-source next-generation chip production through Samsung to reduce dependency.
Amon also met with SK Hynix executives to discuss memory semiconductor supply-demand arrangements. With the recent expansion of the AI server and on-device AI markets intensifying shortages in core memory products such as LPDDR (low-power) DRAM, Qualcomm has moved to secure allocations directly. As Qualcomm pushes into the server market in earnest with its AI accelerator "AI200," unveiled last year, cooperation on High Bandwidth Memory (HBM) and SOCAMM is also understood to have been discussed in depth. The move mirrors recent Korea visits by the CEOs of Nvidia and AMD, who similarly reinforced memory partnerships.
An industry official commented, "Qualcomm has effectively re-evaluated Samsung Foundry's technological capabilities and acknowledged SK's influence in memory. It was an occasion that once again confirmed the standing of Korean companies in the global semiconductor supply chain."
Separately, it is understood that Amon did not meet with Samsung Electronics DX Division President Roh Tae-moon — a key customer of Qualcomm's Snapdragon series — during this trip.

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