ClassOne Technology

Our Solstice® GoldPro™ plating chamber delivers exceptional uniformity with high-throughput gold plating in one advanced solution. Faster deposition, better yields, smarter design. Watch: youtube.com/watch?v=RLKBWa… #Electroplating #AdvancedPackaging #Microelectronics

Heading to IEEE ECTC & CS Mantech? Visit us at booth 506 (ECTC) & 501 (CS MANTECH) to learn how our Solstice® platform advances single wafer processing for next-gen devices. Email sales@classone.com to book a meeting. #CSMantech #Semiconductors #ECTC #microelectronics

Metal lift-off challenges slowing you down? Our Solstice® platform delivers precision, repeatability & scalability—reducing defects and boosting yield. Learn more 👉 classone.com #Semiconductor #MetalLiftOff #Semiconductor

Meet our team at booth 501 at CS Mantech & booth 506 at ECTC to learn about our Solstice® platform for next-gen single-wafer processing. Schedule a meeting: sales@classone.com #CSMantech #ECTC #Semiconductors #Microelectronics #AdvancedPackaging

The future of advanced packaging is denser IO, lower power, and better heat management. Our Solstice® platform and multi-metal stack pillar technology delivers higher interconnect density and scalability. Learn more: classone.com/markets/advanc… #AdvancedPackaging #Semiconductor

As optoelectronics advance to satisfy AI data center needs, high-performance gold plating is required.  The world’s largest optoelectronics and photonics device makers trust ClassOne Technology. Learn more: classone.com/technology/adv… #GoldPlating #SemiconductorManufacturing

We’re growing our sales team! Hiring an Account Manager to drive new business and manage strategic accounts in semiconductor process equipment across CA and TX. Join us delivering innovative wet process solutions that improve yield and performance. Apply: linkedin.com/jobs/view/sale…

Advanced packaging is accelerating in 2026. Our CEO shares how AI, data center, and photonics demand is driving the need for tighter process integration, which platforms like Solstice are designed to support. Read the viewpoint with @Semi_Dig: …ok-supplement.semiconductordigest.com/outlook-supple…

Our Solstice supports metal liftoff with a face-down MLO chamber, flood soak, and high-pressure swing arm. The stainless-steel design enables safer solvent handling while reducing operator exposure and fire risk. youtube.com/watch?v=yuSKWw…

We’re at SEMICON West! Meet us at booth #647 to learn more about our Solstice® Max series single-wafer processing platform. Learn more: classone.com #SEMICONWest #300mm

Introducing Solstice® Max. Unveiled at #SEMICONWest, our modular 300mm single-wafer platform builds on the S-Series. Purpose-built for advanced WLP, it processes 200mm & 300mm wafers with unmatched price-to-performance. Visit booth #647: classone.com/news_posts/cla… #SolsticeMax

Heading to Phoenix for SEMICON West 2025? Visit us at booth 647 to see the Solstice Single-Wafer Platform. Scalable 2–8 chamber systems handle everything from electroplating to surface prep on silicon, glass, and more. Schedule a meeting: sales@classone.com

We’ve entered a joint development agreement with Silicon Austria Labs (SAL) focused on advanced packaging. SAL has purchased a Solstice® S8 system to support hybrid bonding, fan-out WLP, high aspect ratio TSVs, and more. classone.com/news_posts/cla…

Our Solstice® S8 system is headed to Penn State to support R&D in photonics, MEMS, quantum packaging, and more. The platform delivers advanced processing on glass substrates in a single tool. Learn more: classone.com/news_posts/pen…

ClassOne Technology is hiring an Electrical Engineer in Kalispell, Montana. Join us in developing advanced semiconductor plating tools and innovative manufacturing solutions. Apply here: linkedin.com/jobs/view/4278…

AOI selected our Solstice® S8 system to support high-performance optoelectronic device production on InP substrates. With gold plating and metal lift-off, it’s built for the demands of AI infrastructure. classone.com/news_posts/app…

Designed to meet WLP demands, Solstice® CopperMax™ is built for critical plating needs like Cu RDL, high-rate copper pillars and complex multi-metal stacks. Learn more: classone.com/markets/advanc…

We’re excited to launch our fifth university collaboration and first in Canada with the Université de Sherbrooke’s 3IT, where our Solstice® LT system will enable the precision and repeatability needed for advanced packaging R&D. Learn more: bit.ly/4eyJSk6

We’re thrilled to announce FUJIFILM Dimatix has placed a repeat order for our ClassOne Solstice® GoldPro™ single-wafer processing system to enhancing durability, uniformity and performance for their inkjet printheads. Learn more: bit.ly/4luZtn5

We’re heading to @csmantech in a few weeks! Stop by booth 512 to discover the power of the Solstice® platform. Let’s connect: sales@classone.com #Semiconductors #WaferProcessing