Chief Info
61.9K posts

Chief Info
@HodlerChief
Just reading and reposting what I'm interested in atm.

Richard Werner, the ex WEF young global leader shocked me yet again with his chilling insights. You may recall in 2023 he revealed that the purported end game was CBDCs implanted under the skin, using universal basic income to force acceptance. Now we’re being told UBI will be needed due to AI taking our jobs. And here’s the clincher!! He believes the real reason they’re building massive centralised AI data centres is for the implementation of CBDCs. If this is true, an agenda we thought we had defeated is still coming together in plain sight.



My conversation with @winstonweinberg, co-founder of @Harvey. 0:00 The List that Powers His life and Work 2:20 How to Say “No” 7:26 3 Principles for Decision-Making 8:18 How Harvey is Changing the Legal World 11:36 The Cold Email to Sam Altman 12:56 The Demo Strategy that Shocked 17:55 Advice Winston Didn't Take 19:34 The Deal that Almost Killed Harvey 21:56 How to Build Resilience to Failure 24:00 How Winston Hacks His Stress 29:36 Creating a Sense of Urgency on Your Team 31:29 Who Not to Hire 35:09 How to Screen for Resiliency in Interviews 45:28 Does AI Make a Better Lawyer? 48:54 The Future Law Firms 54:52 Why Legal Costs Aren't Going Down 00:56:48 3 Principles The Work 01:00:54 How Winston Defines Success Listen now 👇 (Includes paid partnerships.)




Hermes Agent now can orchestrate the @OpenHandsDev agents with a new optional skill!
`hermes update` then do `hermes skills install official/autonomous-ai-agents/openhands`
Reminder: You can already do this for claude code, codex, opencode, and hermes itself, you can force load the skill with `/








继续思考, 华为在挑战里面没有谈散热,这是我比较诧异的。 目前两层堆叠,我觉得还有些散热的解法,但如果到三层Active Logic Stack或者更多之后,散热会从工程问题变成架构主问题。。。 目前流行的双层堆叠的技术AMD V-Cache,Intel Foveros和TSMC SoIC,还属于用冷cache叠热logic,因为SRAM功耗较低,热密度低,可用做Top Die,所以散热还能接受。 结构如下所示: SRAM |||| CPU 但华为的论文里是Logic-on-Logic。 即: Active Logic |||| Active Logic |||| Active Logic 这就完全不同了,这种多层Active Logic,热无法横向扩散,所以中间的Logic Die直接变成了烤箱,传统散热是完全扛不住的。 三层或者三层Active Logic堆叠之后,必须进入主动式散热时代!冷却液必须进入封装内部。 变成, Active Logic + Microfluidic Channel |||| Active Logic + Microfluidic Channel |||| Active Logic + Microfluidic Channel 液冷液冷液冷是关键!关键得说三次。。。 以后芯片设计里面需要Thermal Topology Architect,因为:热路径本身会决定Layout。 对的,本人的判断是:华为将来3层和3层以上的LogicFolding路径里面,Thermal将是最大的未解难题,甚至比EDA还难!







