Intel Foundry

As AI accelerators push beyond reticle limits, packaging is becoming a key scaling challenge. A recent Chipstrat analysis highlights how Intel Foundry’s EMIB architecture can help improve scalability, yield, and cost efficiency for large AI packages. Read here: ms.spr.ly/6016vVn5A #IntelFoundry #Semiconductors

The latest from @USATODAY explores how Intel Foundry is helping drive the next era of semiconductor innovation, from advanced manufacturing to resilient supply chains. Take a closer look here: ms.spr.ly/6010vpFsC #IntelFoundry #Semiconductors

Where the world’s most advanced chips are built matters. The latest from @USATODAY highlights semiconductor innovation, resilient supply chains, and the future of computing. Featuring insights from Intel Foundry leadership and industry analysts: ms.spr.ly/6016vT744 #IntelFoundry #Semiconductors

At ISSCC 2026, Myung-Hee Na, VP of Systems and Technology Research, spoke with students about how engineers are shaping semiconductor innovation in the AI era—and why this field matters now more than ever. ms.spr.ly/6010vuJXC #IntelFoundry

The future isn’t given. It’s built. From concept to creation, Intel Foundry helps turn vision into reality. The future is yours for the making. ms.spr.ly/6015vPVYx #IntelFoundry

Meet IRIS—Intel Foundry’s AI-enabled collaborative robot transforming interface test adapter inspection. By combining robotics and computer vision, IRIS cuts inspection time by 30% and improves quality consistency at scale. Learn more: ms.spr.ly/6014vO2Jy

Power routing is a growing bottleneck. PowerVia moves it to the back of the die, improving efficiency with 5–10% better utilization and up to 4% performance gains. Learn more: ms.spr.ly/6013v3RD1

On Intel 18A, Omni MIM improves power delivery by reducing inductive power droop for more consistent performance under dynamic workloads. Built for technologies that require fast, high intensity compute. ms.spr.ly/6013vHZbS #IntelFoundry #Semiconductors

In this latest blog, Intel Foundry highlights how it is helping accelerate trusted microelectronics from design to deployment through programs like REMEDE and RAMP-C. Read more: ms.spr.ly/6019vHZTN #IntelFoundry

Mission-critical innovation requires trusted collaboration. Intel Foundry supports initiatives like RAMP-C and SHIP—helping enable secure access to advanced nodes and packaging for ADG systems, while also fostering a trusted ecosystem through the USMAG Alliance and Chiplet Alliance. Read more: ms.spr.ly/6015vESL7 #IntelFoundry #Ecosystem

Intel Foundry EMIB enables high bandwidth, low latency chiplet connections with flexibility and efficiency. A proven path to scalable system performance. ms.spr.ly/6017vESbx #IntelFoundry #Semiconductors

Semiconductor innovation starts with talent. Join the SEMI Pacific Northwest Breakfast Forum for a great lineup of conversations on workforce and collaboration. Register here: ms.spr.ly/6018vDdw4 #IntelFoundry #Semiconductors

A new @TheFuturumGroup report highlights how chiplet-based XPU design is shaping what comes next and how Intel Foundry is enabling it. Read more: ms.spr.ly/6015v6EVv #IntelFoundry #AI

From Rio Rancho, New Mexico, Intel Foundry is furthering advanced packaging and strengthening the U.S. semiconductor supply chain—with continued investment in local talent and sustainable operations. ms.spr.ly/6016QhYqQ #IntelFoundry #SupplyChain #Manufacturing

"As Intel Foundry continues its focus on strong, customer‑driven execution, I’m excited to welcome Shawn (Seung Hoon) Han to our leadership team. Shawn will be joining us in May as senior vice president and general manager of Foundry Services, reporting to me. Shawn brings valuable expertise in the semiconductor industry from his three decades at Samsung, including most recently overseeing sales at Samsung Foundry. He also offers impressive technical acumen from his work on multiple logic process nodes beginning in 1996. Shawn’s leadership will be an important addition to our team, and he is joining at an exciting time as we continue to execute on process technology, advanced packaging, and our overall foundry capabilities. Welcome to Intel Foundry Shawn!" - Naga Chandrasekaran, EVP & GM of Intel Foundry

Power meets control on a single chiplet. Intel Foundry is pushing GaN further with integrated digital logic, reducing energy loss and enabling more efficient systems for what’s next. Learn more: ms.spr.ly/6010QCRtA #IntelFoundry #GaN

The next AI breakthrough might come from packaging—not just silicon. As AI workloads grow, integrating chiplets efficiently is becoming a defining challenge for the industry. See more from @WIRED: ms.spr.ly/6016Q7OZ2 #IntelFoundry #AI

Intel Foundry applies AI across the full factory. From defect inspection to die prediction to identify issues earlier and improve yield at scale. More via @eetimes: ms.spr.ly/6010QN4Le #IntelFoudnry #Semiconductors #AI

Intel Foundry unveils the world’s thinnest GaN chiplet (19 μm). By integrating power and digital control on a single chiplet, it delivers higher efficiency, faster switching, and smaller designs. Learn more: ms.spr.ly/6018Q2h90 #IntelFoundry #Semiconductors

Advanced chip packaging is becoming the key to unlocking performance—connecting chiplets into powerful, unified systems for AI workloads. More via @WIRED: ms.spr.ly/6019Q2gAT #IntelFoundry #AdvancedPackaging #Semiconductors