Jan Vardaman

The latest issue of ChipScale Review features details of AMD's Heterogeneous Integration packages including 3D V-Cache and Elevated Fanout Bridge (EFB)! Lots of details on ChipScaleReview.com

Attending the 3D&Systems Summit in Dresden where hybrid bonding is the main topic of discussion. Many organizations are working to solve issues that will allow increased adoption of the process.

Attending ECTC where we have more than 1,000 attendees! 3D IC hybrid bonding sessions are packed, showing us it is a hot topic this year!

Joint me on February 2022 Semiconductor Industry Speaker Series Webinar Wednesday, February 2, 2022 11:30 AM in Pacific Time (US & Canada) Semiconductor Packaging and Assembly Trends: Outlook for 2022 Register for Free: MEPTEC.org

Great discussion today on thermal issues for 3D at DOE workshop. Tomorrow's discussion is expected to provide insight on metrology for 3D and I/O and Interconnects for 3D!

Lots of emphasis on 3D IC with hybrid bonding at today's Taiwan ISES.

Attending the Taiwan ISES virtually, TSMC has no plan to put assembly in the AZ fab.

Today's Samsung Foundry Forum included a discussion on future advanced semiconductor node package options, including WLP, 2.5D (silicon interposer), and 3D with µbump or hybrid bonding.

Supply of high-performance substrates will continue to be a problem, despite recent capacity additions and plans. wsj.com/articles/a-big…

We are celebrating 34 years in business! Thanks to all our friends and clients for your support all these many years!

Listening to the HIR today. Join me tomorrow at the virtual SiP for the live panel discussion on SiP Challenges for 5G with panel members from Amkor, ASE, Cadence, JCET, and Fraunhofer. Check it out on IMAPS.org

Just concluded the live ECTC Plenary session: Transformation of the Electronics Industry in a Post-Covid World..if you missed it catch the recording. Register at ECTC.net! Don't miss great papers and special sessions. Join the live thermal issuespanel on June 8

During the ISES Advanced Packaging Seminar, Intel just indicated they will offer assembly services for non-Intel silicon with the new IDM2.0 Foundry Service!

Celebrating Earth Day today! How did you celebrate the day? Hope we can all make a difference!

After Bryan Black of AMD's talk today at the IMAPS Device Packaging Conference GBC, one can easily see why everything is coming up chiplets at the most advanced semiconductor nodes....

IMAPS DPC virtual opened today with 2 great keynotes from Samsung and Intel. We had a great panel discussion on Electronics Industry Supply Chain: Is it Broken? Join tomorrow for more!

[PRESS] @CEA_Leti CEO @SabonnadiereE shares insights with @Jan_TechSearch about the future of R&D “𝘛𝘩𝘦 𝘙𝘰𝘰𝘵𝘴 𝘰𝘧 𝘔𝘢𝘯𝘶𝘧𝘢𝘤𝘵𝘶𝘳𝘪𝘯𝘨” in this month’s Circuits Assembly Magazine.🗞️ digital.upmediagroup.com/issue/november… #RnD #RTOs #research #electronic #semiconductor

Samsung's Forum today highlights the importance of partnerships! Great keynotes, panel discussion, and networking options.

IMAPS is off to a great start with keynotes from Intel and AMD! Plenty of work to do in packaging for the future!

Great presentations at the MEPTEC KGD workshop this morning from NVIDIA and Cisco! So much progress has been made in this area! Two more mornings of presentations to come!