Open Compute Project

Delivering an Open Data Center Ecosystem for AI Driving Innovations from Chip to Grid Across Hyperscale and Local Data Centers OCP today announced newly approved OCP contributions, new projects, and recently formed alliances to deliver on its Open Data Center Ecosystem for AI vision announced in October of 2025 covering IT as well as physical data center infrastructure and facilities. The newly approved OCP contributions include (1) a roadmap for open data center facilities for AI, Next Generation ML Infrastructure Design Principles, (2) an overview of proposed direct current power distribution architectures Data Center Facility - Low Voltage DC Power Distribution, (3) guidelines for safe design, operation, and maintenance of energy storage systems Requirements for Energy Storage Systems used in Data Centers, (4) new methods for gathering telemetry to enable data center real time IT and OT management Third Party Integration, Telemetry & APIs, (5) using Ethernet for AI scale-up networking ESUN - Network Operator Requirements, (6) a major expansion to the Open Rack ecosystem for AI with the Open Rack Wide (ORW) specification (7) new reference architectures for building AI Clusters Open Cluster Designs for AI White Paper, Open POD Group for M xPUs, and Open Cluster of N xPUs, and (8) developing open chiplet ecosystems with the Foundation Chiplet System Architecture. Read the full story here: bit.ly/4w4Ao8C

New white paper from OCP on Understanding how to Integrate Quantum Processing Units into Data Center Infrastructure. Moving Quantum computing from lab environments and small private data centers to production deployments will require a paradigm shift on the part of DC builders and Quantum vendors. The OCP Community is actively addressing these integration hurdles starting with a white paper to identify the common architectural, operational, and integration considerations for deploying quantum processing units (QPUs) in datacenter infrastructures. View the white paper here: bit.ly/4tD03mW This paper was authored by quantum market leaders including the National Quantum Computing Center, D-Wave, Dell Technologies, Diraq, Fujitsu, Infleqtion, IonQ, IQM, Maybell, ORCA Computing Ltd, Oxford Quantum Circuits, Pasqal, QBlox, Quantum Brilliance, Zero Point Cryogenics, and ZPT Corp. If you are attending the 2026 OCP EMEA Summit tomorrow in Barcelona, Spain, check out the Quantum track at the OCP Future Technologies Symposium. See the event page, full schedule and register here: bit.ly/4b4PpyM

The future of sustainable data centers isn’t coming—it starts tomorrow. Join global innovators at the 2026 OCP EMEA Summit in Barcelona, where bold ideas turn into real-world impact. From energy efficiency breakthroughs to heat reuse and next-gen AI infrastructure, this is where hyperscale thinking becomes deployable solutions across EMEA. Barcelona International Convention Center April 29–30, 2026 This is your moment to be in the room for visionary keynotes, deep technical sessions, a packed Expo Hall, live demos in the Innovation Village, and hundreds of Breakout Sessions, including three dedicated AI tracks, real-world adoption stories, and a look 5+ years ahead at what’s next. If you care about sustainability, scale, and innovation, this is where it all comes together. Last chance to register: bit.ly/4b4PpyM #OCPBarcelona26

Registration is now open and the full schedule is live! Join us in Montreal for the 2026 OCP Canada Tech Day June 10–11, 2026 The future of AI infrastructure is being built—and this is where you’ll see it first. From next-gen AI data centers to hybrid classical + quantum environments, this event brings together top innovators, researchers, and industry leaders shaping what’s next. What to expect: • Visionary keynotes from leaders like 650 Group, AMD, Arm, IBM, Microsoft, Numana and Ranovus • Deep-dive sessions on AI/HPC clusters, edge AI ecosystems, and quantum integration • Interactive breakout discussions tackling real-world challenges • A curated networking experience with the global OCP community Whether you’re designing infrastructure, deploying AI at scale, or exploring quantum integration—this is the room you want to be in. Secure your spot + view the full agenda: bit.ly/4tFfWsX Limited sponsor opportunities still available

The Call for Presentations is still open for the 2026 OCP APAC Summit, taking place August 11 to 12 in Taiwan. From AI infrastructure and advanced packaging to cooling, photonics, and open data centers, this is where the industry comes together to share what’s next. This year’s program spans 11 key areas, including AI Clusters, Networking, Photonics, Chiplets & Advanced Packaging, and more. Submit your proposal by May 18 and be part of the conversations shaping the future of open compute. Learn more: bit.ly/3ObBtu2 Registration is now open. Thank you to our Selection Committee, which includes leaders from across the ecosystem who will guide speaker and content selection. @OpenComputePrj #OCPAPAC26 #OCP

Join the OCP at the Tech Show Frankfurt 2026 (6–7 May) to explore how open hardware is revolutionizing the data center landscape, particularly in the era of AI and sustainable infrastructure. Session 1: Open path ahead – The Open Compute Project and the Open AI Fungible Data Center Date & Time: 6 May, 14:05–14:30 Location: Theatre: Green Innovation Format: Solo/Panel Discover how OCP’s open designs are enabling the next generation of AI-optimized, energy-efficient data centers. This session will feature: Speakers: -Raúl Álvarez, European Market Development Manager, Open Compute Project -Jeroen Burks, Data Center Consultant, ThermoIT Session 2: Direct Current Powering the Data Center – A Shift to Meet IT Demands Date & Time: 7 May, 14:00–14:25 Location: Theatre: Green Innovation Format: Panel Explore the transformative shift toward direct current (DC) power in data centers, addressing adoption challenges from grid to chip. This panel discussion will bring together leaders from the power distribution industry to share insights on powering the next generation of IT infrastructure, and how we are moving the industry forward at OCP’s Power Distribution sub-project. Visit us at our booth J055! OCP will be available throughout the event to discuss open hardware solutions, best practices, and real-world deployments. Connect with our team to explore how OCP can support your data center innovation goals. Why Attend? ● Gain firsthand insights from industry experts and real-world case studies. ● Learn how OCP and its partners are shaping the future of sustainable, scalable data center solutions. ● Network with pioneers driving innovation in AI and energy-efficient infrastructure. Location: Messe Frankfurt, Hall 8, Ludwig-Erhard-Anlage 1, 60327 Frankfurt am Main Programme Access: Explore the full conference schedule and secure your spot today: bit.ly/4vKzZaW

OCP Partners with @CloserStill Media to Launch @Digital Infrastructure World (DIW) event in the heart of Silicon Valley. The industry has reached a critical inflection point where the traditional separation of IT and OT is no longer sufficient for the demands of modern AI infrastructure. To address this, the Open Compute Project (OCP) Foundation is proud to announce its collaboration with CloserStill Media for the launch of Digital Infrastructure World (DIW). Debuting February 3-4, 2027, at the San Jose Convention Center, DIW will serve as a premier strategic forum in the heart of Silicon Valley. Read the full announcement: bit.ly/4cXaBYa Visit the event page for more details: digitalinfrastructure.world

The Innovation Village at next week’s 2026 OCP EMEA Summit in Barcelona, Spain brings together hands-on technology demonstrations where participants can experience early-stage and emerging open hardware innovations directly. Check out a few of the stations featured at this year's event: -Data Center Automation -Adaptive Cold Plate Cooling -OCP MHS Modular Plug-and-Play (M-PNP) Tools -Real-Time Energy Routing (RER) -OBMF End-to-End Demo -Generative AI Edge Inference -GaN-Based High-Efficiency Power Boards -Standardizing Embodied Carbon Disclosure You also won’t want to miss the keynotes, three different AI tracks, and a full track on adoption stories including practical feedback on how to deploy OCP in Europe. This week is your last chance to register before prices go up onsite. View the full schedule and register here: bit.ly/4b4PpyM #OCPBarcelona26

Don't miss OCP's 7th annual Virtual Storage Summit. During this event, we will cover the latest in cutting-edge storage innovation. When: Wednesday, May 13, 2026 8:00 AM - 12:00 PM PDT Where: Zoom Virtual Event Topics to be discussed: OCP L.O.C.K Linux I/O SNIA/SFF OCP Storage Spec Updates Fleet Health, Telemetry and Monitoring Multi-VM environments, Live Migration, Virtualization Perspectives from hyperscale's, SSD suppliers And more! All are welcome but registration is required to receive the Zoom information. Register Today to Join Us: bit.ly/4cuzlph And thank you to our sponsors! @EverPure_ @MicronTech @Phison_USA @Samsung @SanDisk @ScaleFlux @silicon_motion

Did you know that OCP is hiring for three positions? Click the links below to review the job descriptions and learn how to apply. Marketing & Events Manager - bit.ly/4chcqz5 Principal Data Center Facilities Architect - bit.ly/4csmkwu Solution Provider Program Coordinator - bit.ly/4mCjr0H

A breakthrough for AI infrastructure: the first autonomous robot capable of handling 5-ton AI racks across an end-to-end orchestration flow will be unveiled at 2026 OCP EMEA Summit in Barcelona, Spain April 29 - 30. Designed to operate seamlessly across the full deployment lifecycle—from dock to data hall to precise cold aisle placement—it enables safe, high-throughput, and deterministic AI capacity deployment. As AI data center systems continue to scale in density and coupling, this marks a meaningful step toward closing the “last 100 meters” of the AI race — where physical operations increasingly define Time-to-Compute. This solution reflects a broader push toward industry advancement. The concept was initiated by Meta’s Infra Robotics team, with solutions developed by DS Automotion and Grenzebach, advancing a shared industry vision for scalable, automation-native AI infrastructure. In collaboration with the OCP committee, the live robotic demo will be showcased at the OCP EMEA Summit Innovation Village. Join Eric Xu (Meta), Wolfgang Hillinger (DS Automotion), and Sven Schreiner(Grenzebach) on April 30 at 8:50 AM for their presentation “Robotics as Infrastructure for AI-Driven Data Centers”—where they will discuss the evolution of robotics into a core infrastructure layer for AI, and the path forward to standardize and scale autonomous data center operations. Check out these videos: bit.ly/48PVvkG bit.ly/4vt4Cl7 Learn more and register for the 2026 OCP EMEA Summit here: bit.ly/4b4PpyM

OCP Joins Forces with AITA, CIAT and the IOWN Global Forum for the 2026 OCP APAC Summit in Taipei City, Taiwan OCP announces a collaboration with the AI on Chip Taiwan Alliance (AITA), the Cloud Computing & IoT Association in Taiwan (CIAT), and the IOWN Global Forum to jointly host the 2026 OCP APAC Summit, strengthening regional collaboration on open, scalable, and next-generation digital infrastructure across the Asia-Pacific region. Registration is now open - sponsorship sales are filling up fast and about to close! Sponsorship deadline is May 1, 2026. Read the full story here: bit.ly/4vCesBu Visit the event page for more details on the event: bit.ly/4mCuwPC

EPRI and Open Compute Project Announce Collaboration to Advance Data Centers as Flexible Grid Resources With shared commitment and overlapping stakeholders, the two global research organizations can strengthen the foundation for deeper technical integration and support industry‑wide impact across global markets, improving pathways to connect rapidly growing digital infrastructure to power systems and optimizing technical designs to develop the best framework for operationalizing data center flexibility. EPRI and OCP's collaboration brings together extensive expertise and expansive global communities ranging from technology providers to multiple stakeholders in the energy and data center industries. EPRI complements the OCP Community with real‑world field demonstrations underway at data centers operating across Europe and the U.S., exploring flexible load solutions that streamline interconnection processes and support wider adoption of compute flexibility at scale. Read the full story here: bit.ly/4mCssXS

OCP and Current/OS Advance Strategic Alliance to Enable Direct Current Adoption in AI Data Centers at 2026 OCP EMEA Summit in Barcelona The OCP Foundation and the Current/OS Foundation progress joint development efforts to accelerate the emergence of next-generation data centers powered by direct current. In lead-up to the 2026 OCP EMEA Summit in Barcelona (April 29–30, 2026), the Current/OS Foundation highlights the progress of its strategic collaboration with the Open Compute Project Foundation (OCP), formalized in December of 2025 through the signing of an alliance aimed at accelerating the development of direct current-powered data center architectures. This participation marks a key milestone in driving industry alignment around DC solutions for AI-driven infrastructures, reflecting a shared ambition to transform digital infrastructures into more efficient, sustainable, and high-performance systems, and to establish new standards for the electrical architecture of next-generation data centers. Read the full story here: bit.ly/4dCfgQf Learn more about the 2026 OCP EMEA Summit here: bit.ly/4b4PpyM

Chiplet Future: Foundation Chiplet System Architecture (FCSA) “The future of Silicon is Modular, Scalable, and Standardized Chiplets” The rapid acceleration of the AI economy is reshaping global compute infrastructure. From hyperscale data centers training trillion-parameter models to edge devices running AI inference locally, the demand for compute performance, memory bandwidth, and energy efficiency has never been higher. Traditional monolithic SoC scaling can no longer keep pace with AI’s diverse and ever-expanding workloads. As a result, the industry is embracing chiplets - modular silicon components that enable flexible system composition, faster innovation cycles, and more efficient use of advanced process technologies. To truly unlock the potential of modular silicon, the industry needs well-defined common chiplet standards that allow chiplets from different vendors and architectures to work together seamlessly. This openness is essential to scaling the AI economy efficiently, fostering collaboration, and accelerating innovation across the entire compute landscape. Read the full story of the introduction of the FCSA here: bit.ly/4t0vreM

Now open: Call for Presentations for the 2026 OCP APAC Summit in Taiwan (August 11–12). From AI infrastructure and advanced packaging to cooling, photonics, and open data centers—this is where the industry comes together to share what’s next. The 2026 OCP APAC Summit Call for Presentations is organized into 11 main categories: Adoption of OCP-Recognized Equipment & Facilities, AI Clusters, AI Computing Continuum, Chiplets & Advanced Packaging, Cooling Environments, Future Technologies Symposium, Networking, Open Data Center for AI, Photonics, Server and Storage & Memory. Submit by May 18 and be part of the program shaping the future of open compute. Details can be found here: bit.ly/3ObBtu2 Registration is live. Thank you to our amazing Selection Committee - representatives from the world’s leading organizations will spearhead speaker and content selection. @OpenComputePrj #OCPAPAC26 #OCP

Fifteen years ago today, the Open Compute Project Foundation began with a simple idea: share data center designs openly to improve efficiency and accelerate innovation across the industry. What started in 2011 as a move to open-source hardware—delivering meaningful gains in energy use and cost—has grown into a global community advancing open infrastructure together. Read the initial announcement here: bit.ly/4sYlG0U @OpenComputePrj #OCP

The future of sustainable data centers is calling. Join global innovators at the 2026 OCP EMEA Summit—where bold ideas meet real-world impact. From energy efficiency breakthroughs to heat reuse and next-gen infrastructure, this is where hyperscale thinking turns into tangible solutions across EMEA. Barcelona International Convention Center April 29–30, 2026 What’s waiting for you: · Visionary keynotes + deep-dive technical sessions · A buzzing Expo Hall packed with cutting-edge deployments · Hands-on demos in the Innovation Village · The Future Technologies Symposium—spotlighting what’s coming 5+ years out (and a $10K prize for the best paper) If you care about the intersection of sustainability, scale, and innovation—this is where you need to be. Secure your spot before April 28 here: bit.ly/4b4PpyM #OCPBarcelona26