aog T
143 posts
Tonight, I will summary 4 points on Huawei Chip.
1. TM metal transfer from Al pad to Cu RDL for HB pitch
2. The density on Huawei roadmap and what is the 1.4nm reference to?
3. SMIC develop roadmap
4. Insight from my AP fab and apple design team friends on “logicfolding “
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Omg!
This reflect at least one thing: SMIC node development truely encounter a huge bottleneck… They achieve N5 density by 2030…
And previously I have ask AP fab guys that why mobile customers do not use 3D package. I will ask again and share this information XD
Zephyr@zephyr_z9
Very impressive roadmap 2026 will be a big density jump for them and good enough for most advanced AI chips
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The reason is HR is reviewing that TSMC employee’s paid is too high (at least in Taiwan).
Even PMD got S-, job grade 33 can get ~100K US dollor which is higher than manager paid in other company.
New and shocking company policy will also be announced this year later XD
Jukan@jukan05
To be precise, they say 原因不公開. The speculated reasons seem to fall into four broad categories: Cost burden from U.S. fabs / overseas expansion Higher capex / investment burden from new technologies Prioritizing shareholder returns and dividends Some internal reason they supposedly can’t disclose.
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