Applied Materials

AI is the most important inflection point in our lifetime. As computing demand accelerates, the next era of innovation will depend on advances in leading-edge logic, DRAM and advanced packaging, all areas where Applied Materials and our materials engineering expertise plays a critical role. At Applied Materials, we deliver material innovation that enables chip and packaging architectures that will power AI for years to come. #MakeItMaterial

The race for energy-efficient AI isn't won at the software layer. It starts in the silicon. DRAM and advanced packaging are two of the most critical and underappreciated levers for building energy-efficient AI systems. As data movement overtakes compute as the dominant power cost, the engineering choices we make in memory and integration define what's possible. We're hosting a masterclass that breaks it all down: HBM stacking, hybrid bonding, 3D chiplet architectures, and the materials innovations making next-gen AI infrastructure viable. 🔗 Save your spot: bit.ly/4aA8E2z

Applied Materials was proud to host U.S. Trade Representative Amb. @jamiesongreer to discuss our critical role in enabling semiconductor innovation which will advance next generation AI computing.

We've unveiled SENZ™ a fully integrated ambient visual platform that combines waveguide optics, light engine, sensing, vision correction, and electronic dimming in a single co-optimized system. ir.appliedmaterials.com/news-releases/…

The future of augmented reality just got a major boost and Applied Materials is announcing it where the Extended Reality (XR) industry converges. Today at AWE, we announced a long-term joint development agreement with EssilorLuxottica to accelerate next-generation intelligent optical systems for AR and AI-powered smart eyewear. Here's what this means: Combining Expertise: Applied Materials' photonics and materials engineering + EssilorLuxottica's 70+ years of lens innovation = breakthrough optical platforms The Focus: Waveguides, adaptive lens systems, and advanced materials that deliver lightweight, high-performance AR experiences The Vision: Making smart glasses accessible, scalable, and compelling for consumers worldwide Smart glasses won't be mainstream without a visual system that is designed from the start to optimize all the components. This partnership accelerates that timeline. The convergence of advanced optics, AI, and wearable technology is unlocking entirely new categories of computing experiences and we're excited to lead this transformation alongside a true innovation partner. Learn more: bit.ly/4uHfQRx #AWE2026

The surge in AI compute is accelerating the industry’s transition to advanced 3D device architectures, including gate-all-around (GAA) transistors and high-layer-count 3D NAND. To address this emerging challenge, we're introducing two new chipmaking systems designed to achieve precision processing in increasingly deep and narrow 3D structures. Together, the new Centris™ Spectral™ SiN ALD* and Producer™ Selectra™ Mo Etch provide chipmakers with precise control over both dielectric film deposition and metal removal in high-aspect-ratio structures. The result is more uniform materials engineering at advanced nodes, enabling continued 3D scaling with better device performance, tighter process control and improved manufacturability across logic and memory applications. Learn More: bit.ly/4xvZo9o

Momentum in the AR glasses market is accelerating rapidly, with waveguide-based devices growing an impressive 600% year-over-year. But with this growth comes a key challenge: delivering exceptional visual quality while ensuring AR experiences are seamless, comfortable, and truly wearable. Applied Materials is helping solve this challenge by bringing decades of materials engineering expertise and semiconductor-scale manufacturing to the AR ecosystem. Learn more: bit.ly/3QAgfXU

Applied Materials has announced the expansion of our manufacturing and R&D operations in Singapore with the opening of our new Tampines Campus. This investment is designed to support the global build-out of AI infrastructure and strengthen the company’s global manufacturing footprint, which also includes facilities in the United States, Europe, Israel and Taiwan. Learn more: bit.ly/4ohktjs

Applied Materials President and CEO Gary Dickerson recently joined CNBC’s Mad Money with Jim Cramer to discuss one of the most powerful shifts shaping our industry today: the rapid acceleration of AI. Dickerson's message was clear, this is a defining moment for semiconductors, stating “It is the greatest time in the history of the industry and for Applied Materials… AI is driving incredible computing demand.” As AI adoption scales across industries, the need for more powerful, energy-efficient chips continues to grow. This is driving a new wave of investment in semiconductor manufacturing and the infrastructure required to support it. With deep collaboration across our ecosystem and continued investments in innovation and capacity, Applied Materials is well positioned to help enable this transformation. Read more and watch the full interview: bit.ly/43fg8DV

Today Applied Materials announced that SCREEN Semiconductor Solutions Co., Ltd. has joined the EPIC Center as its newest innovation partner. The collaboration will bring together SCREEN SPE’s expertise in wafer cleaning technology with Applied's leadership in materials engineering to develop co-optimized process solutions for the world’s most advanced chips. “The EPIC Center is designed to dramatically accelerate the commercialization of next-generation semiconductor technologies by co-locating and co-innovating with customers and partners across the entire semiconductor ecosystem,” said Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials. “SCREEN SPE’s wet etch and surface preparation capabilities are deeply intertwined with virtually every process step in chip manufacturing. By bringing our technologies together at the EPIC Center, we can develop co-optimized process solutions that address the increasingly complex surface engineering challenges our customers face as they push to the next technology frontier.” Learn more: bit.ly/4nQH5Hv

Today Applied Materials announced that Broadcom will join Applied’s EPIC platform as an innovation partner to accelerate development of advanced chip packaging technologies critical to next-generation AI systems. “The EPIC platform is designed to drive co-innovation across the ecosystem to change the way semiconductor technologies are developed and commercialized,” said Gary Dickerson, President and CEO of Applied Materials. “This new model gives leading system designers like Broadcom early access to foundational innovations in materials and process equipment, providing an opportunity for deep collaboration to accelerate the introduction of new advanced packaging technologies.” Learn More: bit.ly/4nD1rDY

Our Q2 FY26 financial results included record revenue and earnings, along with our highest gross margin in more than 25 years. Applied's strong momentum is driven by rapid global AI infrastructure expansion, leadership in key high-value semiconductor markets, and our agile operations and supply chain execution to meet rising demand. Learn more: bit.ly/43an6d9

Today we reported results for the second quarter of fiscal 2026. Check out this snapshot to learn more about our financial results and business highlights. ir.appliedmaterials.com/news-releases/…

Applied Materials has announced that @ASU, @rpi and @StanfordEng will join the company’s EPIC Center in Silicon Valley as inaugural research partners. Through close collaboration with Applied’s scientists and engineers, university teams will engage in high velocity research programs across advanced materials, novel process and device technologies, and chip architecture inflections – leveraging the synergy of academia and industry to accelerate energy efficient innovations for next generation AI chips. ir.appliedmaterials.com/news-releases/…

Today Applied Materials announced a new innovation partnership with TSMC to accelerate the development and commercialization of semiconductor technologies required for the next era of AI. Working together at Applied’s EPIC Center in Silicon Valley, the companies will co-innovate to advance materials engineering, equipment innovation, and process integration technologies designed to deliver energy-efficient performance from the data center to the edge. “Applied and TSMC share a long history of deep collaboration built on trust and a shared commitment to advancing innovation at the leading edge of semiconductor technology,” said Gary Dickerson, President and CEO of Applied Materials. “By bringing our teams together at the EPIC Center, we are strengthening that partnership and accelerating the development of technologies to address the unprecedented complexity driving the chipmaking roadmap.” Learn more: bit.ly/3Ryr9xj

Today we announced we have entered into a definitive agreement with ASMPT SEMI Solutions to acquire its ASMPT NEXX, Inc. business, a leading supplier of large-area advanced packaging deposition equipment for the semiconductor industry. The addition of the NEXX team and products will broaden Applied’s portfolio of panel-level advanced packaging technologies which are designed to enable chipmakers and systems companies to build larger-body AI accelerators for higher energy-efficient performance. Learn more: bit.ly/3P7fcxM

As AI drives demand for faster, more energy‑efficient chips, transistor customization is becoming just as important as scaling. The Applied Materials Trillium™ system enables chipmakers to precisely engineer materials at the atomic level, allowing transistor performance to be tuned for specific AI workloads. By combining advanced deposition, integration and process control in a single platform, Trillium helps speed development of next‑generation devices while delivering better power, performance and yield at leading‑edge nodes - a key step toward more flexible, application‑optimized semiconductors in the AI era. Learn more: bit.ly/4tu72id #MakeItMaterial

Want to learn more about Applied's material innovation in transistors but missed our recent Leading the Future of Logic Master Class? Watch this video where we describe how shallow trench isolation enables increased transistor speed and power efficiency. #MakeItMaterial

Today we announced that Advantest Corporation, a leading semiconductor test equipment supplier, will join Applied’s EPIC platform as an innovation partner to strengthen the links between front-end manufacturing technologies and back-end testing of chips and packages, helping chipmakers bring new designs to market faster. To support this partnership, Advantest has established a new, state-of-the-art Innovation Center on Applied Materials’ R&D campus in Silicon Valley, that will seamlessly connect with Applied’s EPIC Center. “Applied Materials designed the EPIC platform to dramatically accelerate the commercialization of next-generation semiconductors by co-locating and co-innovating with our customers and partners,” said Gary Dickerson, President and CEO of Applied Materials. “By collaborating side-by-side with Advantest, we can develop solutions that enable chipmakers to optimize end-to-end semiconductor production flows and bring new designs to market faster and more efficiently.” Learn more about the partnership: ir.appliedmaterials.com/news-releases/…

AI is driving the semiconductor industry into the angstrom era. Next‑generation AI GPUs in development are expected to integrate 300+ billion transistors on a single chip, pushing performance, power efficiency, and manufacturability to new limits. Applied Materials’ Producer™ Precision™ Selective Nitride PECVD system addresses one of the toughest challenges in advanced GAA logic: preserving shallow trench isolation (STI) at atomic‑scale dimensions. Using an industry‑first selective bottom‑up deposition, the system places dense silicon nitride only where needed, protecting isolation through 500+ downstream process steps. The result: lower parasitic capacitance, reduced leakage, and improved performance‑per‑watt without damaging sensitive underlayers - all thanks to low‑temperature processing. Now being adopted by leading foundry‑logic manufacturers at 2nm and beyond, Precision Selective Nitride highlights how materials engineering, not lithography alone, is driving the next phase of chip scaling. Learn more: bit.ly/4cf85Lx #Semiconductors #AIHardware #AdvancedLogic #GAA #2nm #ChipManufacturing #AppliedMaterials #ProcessTechnology