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Chipstrat

@chipstrat

Semis, optics/networking, physical AI, and more from @austinsemis. If you like Stratechery and SemiAnalysis, you're in the right place

United States Katılım Ekim 2023
4 Takip Edilen2.6K Takipçiler
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Intel Foundry
Intel Foundry@Intel_Foundry·
As AI accelerators push beyond reticle limits, packaging is becoming a key scaling challenge. A recent Chipstrat analysis highlights how Intel Foundry’s EMIB architecture can help improve scalability, yield, and cost efficiency for large AI packages. Read here: ms.spr.ly/6016vVn5A #IntelFoundry #Semiconductors
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Chipstrat
Chipstrat@chipstrat·
Inside the 800G → 1.6T → 3.2T Race Timing is everything. What the industry said about 800G, 1.6T, 3.2T in recent earnings calls chipstrat.com/p/inside-the-8…
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Semi Doped
Semi Doped@semidoped·
Semi Doped's YouTube presence is growing. 2K subscribers strong! 💪🏽
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Semi Doped
Semi Doped@semidoped·
Like this? Sign up today to get more Vik and Austin in your inbox daily. Free! semidoped.com
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Chipstrat
Chipstrat@chipstrat·
The end of an era for VCSELs? This post walks through: • Why VCSELs have dominated short-reach data center optics for decades • The problems that emerge at 200G • Supply chain and economics chipstrat.com/p/vcsels-200g-…
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Semi Doped
Semi Doped@semidoped·
Daily Update - April 30th, 2026
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Semi Doped
Semi Doped@semidoped·
A masterclass on Google's TPU v8 Networking. Two TPU chips? Pssh. We already knew workload-specific silicon was here. But two scale-up networking topologies? That's the actual Google TPU news. Workload-specific interconnects. Think about that. New Semi Doped with @vikramskr and @austinsemis. Copper? Yep. Optics? Yep. What we cover: - TPU splits in two: 8t training, 8i inference. - Virgo: 47 Pb/s scale-out fabric, 100% OCS. - Boardfly scale-up: copper PCB + AECs inside racks, OCS between groups. 16 hops → 7. - Training uses 3D torus (Rubik's Cube). - Inference doesn't. Workload-specific topologies now. - Dragonfly traces to a 2008 paper by Kim, Dally, Scott, Abts. Abts went on to build Groq's interconnect before Nvidia. Chapters: 0:00 Intro 0:21 Two TPUs for two workloads 2:31 HBM, SRAM, and Axion CPUs 7:22 Why networking is the new bottleneck 17:14 Virgo: rebuilding scale-out on optics 25:24 3D torus Rubik's Cube scale-up for training 34:50 Boardfly: scale-up for MoE inference 42:07 Workload-specific everything $GOOGL
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Austin Lyons
Austin Lyons@austinsemis·
You should think about Credo differently than you did six months ago. It's a full-stack, pure-play interconnect company spanning die-to-die, chip-to-chip, rack, and row interconnect. With the HyperLume and Dust acquisitions, Credo gains MicroLEDs plus SiPho PIC capabilities. And a dual CPO roadmap! Not a hedge though. Laser SiPho and MicroLEDs position Credo to serve different customers; every hyperscaler runs a bespoke datacenter roadmap, and both acquisitions already come with hyperscaler customer in hand. Moreover, Credo is running the vertical integration playbook again. Own the IP and silicon, and productize the full solution. This worked well for AECs. ZF Optics now follows that pattern with DSP + PIC in-house; ALCs follow it with DSP + MicroLEDs; OmniConnect follows it with VSR SerDes + gearbox. Good for customers (tighter co-design, ZeroFlap-class reliability, one "throat to choke"), good for Credo margins (no component margin stack paid to third parties). Oh yeah, they acquired CoMira too. Credo already owned the PHY via its SerDes, and now Credo owns Layer 2 too with CoMira's Link-layer, ECC, and MACsec security IP; works across Credo’s scale-up and scale-out AI ambitions spanning Ethernet, ESUN, UALink and PCIe. Quite the pure-play interconnect portfolio. $CRDO investors.credosemi.com/news-events/ne…
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Chipstrat
Chipstrat@chipstrat·
@rob_lh China is an Interesting angle, I will add it to the backlog
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Rob L'Heureux
Rob L'Heureux@rob_lh·
The one piece I wish @chipstrat covered is the fact that, if XRL works, China will get it too. Blocking China access to EUV was always a holding action, but Western lead in semis will evaporate.
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Rob L'Heureux
Rob L'Heureux@rob_lh·
This review is good. The funniest part is IBM saying XRL issues as merely "primarily manufacturing issues, as opposed to issues related to demonstrating proof-of-concept or feasibility". This dismissal encapsulates why IBM has tons of IP and doesn't manufacture chips anymore.
Chipstrat@chipstrat

X-ray lithography worked. The industry chose a different path. @substrate wants to go back. Will it work? What about XLight, ASML, TSMC? chipstrat.com/p/substrate

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Chipstrat@chipstrat·
@Simne1core @substrate Yes, the article says as much, there is still much to do beyond technical feasibility alone
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Simone
Simone@Simne1core·
@chipstrat @substrate In lithography, “it worked” is not enough. The winning platform is the one that can scale source power, mask infrastructure, resist maturity, uptime, and fab integration. Any X-ray comeback has to beat not just physics, but decades of ecosystem lock-in.
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Austin Lyons
Austin Lyons@austinsemis·
It's so much fun talking with builders like Reiner. Pure dopamine for me, and I walk away smarter than I started. Interconnects for MoE, BlueSpec, Little's law. Lots of nuggets in this one.
Semi Doped@semidoped

New interview: @ReinerPope, co-founder/CEO of @MatXComputing A counterintuitive throughput insight: “Low latency means small batch sizes. That is just Little’s law. Memory occupancy in HBM is proportional to batch size. So you can actually fit longer contexts than you could if the latency were larger. Low latency is not just a usability win, it improves throughput.” We get into: • The hybrid SRAM + HBM bet, and why pipeline parallelism finally works • Why sparse MoE drives MatX to “the most interconnect of any announced product” • Why frontier labs are willing to bet on an AI ASIC startup • Memory-bandwidth-efficient attention, numerics, and what MatX publishes (and what it does not) • Why 95% of model-side news is noise for chip design • The biggest challenges ahead 00:00 “We left Google one week before ChatGPT” 00:24 Intro: who is MatX 01:17 Origin story: leaving Google for LLM chips 02:21 GPT-3 and the “too expensive” problem 04:25 Why buy hardware that is not a GPU 05:52 Overcoming the CUDA moat 08:46 Early investors 09:35 The name MatX 09:59 The chip: matrix multiply + hybrid SRAM/HBM 12:11 Why pipeline parallelism finally works 14:22 Reading papers and Google going dark 15:20 Research agenda: attention and numerics 17:06 Five specs and meeting customers where they are 19:24 Why frontier labs are the natural first customer 20:32 Workloads: training, prefill, decode 22:18 Little’s law and the throughput case for low latency 24:29 Interconnect and MoE topology 26:35 Inside the team: 100 people, full stack 28:32 Agentic AI: 95% noise for hardware 30:35 KV cache sizing in an agentic world 32:11 How MatX uses AI for chip design (Verilog + BlueSpec) 34:23 Go to market: proving credibility under NDA 35:12 Porting effort for frontier labs 36:34 Biggest skepticism: manufacturing at gigawatt scale 37:32 Hiring plug @austinlyons @vikramskr

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Chipstrat
Chipstrat@chipstrat·
Right now, the default agentic computer is a Mac Mini running cloud inference. Except Anthropic shut that down. It's a jump ball now. But is this truly the beginning of a new S-curve? Or is it another iPad? chipstrat.com/p/the-agentic-…
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Chipstrat
Chipstrat@chipstrat·
Coherent and the Case for Vertical Integration How $COHR stacks up against $LITE and $AVGO across every layer of the optical stack. Plus growth vectors, things to track, and sell-side sentiment. chipstrat.com/p/coherents-ve…
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