Treda Whisqrere
54 posts


$TSM $ASX $INTC
"TSMC is facing a surge in AI chip orders using its advanced packaging technology, such as CoWoS, but competitors such as Intel are benefiting as the Taiwanese semiconductor powerhouse is unable to keep up with demand."
"Leading this advanced packaging race is none other than TSMC, whose CoWoS (Chip-on-Wafer-on-Substrate) had a head start over the competition and has been the go-to choice for several years. As demand shoots through the roof, even the Taiwanese giant is facing the brunt of existing bottlenecks within the supply chain and is unable to meet demand."
"Intel is aiming to become the 2nd largest advanced packaging provider with its EMIB technologies that are poised to offer several benefits over CoWoS. Furthermore, a wave of Taiwanese packaging and test companies, namely ASE, SPIL, Powertech, and KYEC, is also taking advantage of the situation as TSMC orders face a spill-over effect."
"Reports indicate that Intel, with active support from the US government, is aggressively pursuing advanced packaging, and Taiwanese packaging and testing companies, including ASE, SPIL, Powertech, and KYEC, are also taking advantage of the spillover effect of orders."
"We have already seen reports that NVIDIA will move advanced packaging orders to Intel for its next-gen Feynman GPUs. These are anticipated to utilize Chipzilla's improved EMIB technology."
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