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El equipo de Anthropic acaba de publicar cómo hacer prompts en Claude para sacarle el máximo partido. 24 minutos. Gratis. Directo de los que lo construyeron. Lo he subtitulado al español. Guárdalo 🔖

THE OPTICAL PHOTONICS BOTTLENECK As AI clusters scale past copper’s physical limits, the bottleneck shifts to optical & these are the companies building that layer across the stack: 1. $AAOI building the transceiver layer of the AI network through vertically integrated U.S.-based InP laser manufacturing. It has already secured over $200M in its first volume 1.6T order from one hyperscale customer followed by another $124M in 800G orders from a second. 2. $AEHR building the reliability layer for the optical & AI hardware stack through burn-in & test systems. It just received a record $41M follow-on order from its lead hyperscale customer reinforcing the idea that Sonoma is becoming a key production burn-in platform for high-power AI ASICs. 3. $CRDO building the connectivity layer that helps AI clusters move data faster through active electrical cables, retimers & high-speed interconnect silicon. The DustPhotonics acquisition also extends that platform into silicon photonics before copper becomes a real constraint. 4. $LITE building the laser layer of the AI optical stack through EMLs, optical components & optical switching exposure. The setup is backed by a $2B $NVDA strategic investment & optical circuit switch backlog above $400M with orders reportedly extending through 2028. 5. $VIAV building the testing & validation layer of the optical stack through network instrumentation & photonics measurement tools. It is the picks-and-shovels layer of the transition because every high-speed optical buildout still needs to be tested regardless of which transceiver vendor wins. 6. $COHR building one of the core photonics bottlenecks through indium phosphide lasers, optical engines & communications components tied to next-gen AI networking. It also has a $2B $NVDA strategic investment behind it & is doubling InP device capacity into the 1.6T ramp. 7. $MRVL building the DSP & optical infrastructure layer through electro-optics, PAM DSPs, interconnect silicon & custom networking chips. The Celestial AI deal & NVLink Fusion exposure both strengthen its position as photonics becomes more central to AI cluster design.