Sabitlenmiş Tweet
としやん
996 posts

としやん
@toshi49e
30歳 電機系メーカーに勤務。コンクリート技士の資格を保有。趣味は株式投資
Katılım Temmuz 2020
316 Takip Edilen2.4K Takipçiler
としやん retweetledi

SK Hynix Places First Order for Applied Materials–Besi Hybrid Bonding Equipment
SK Hynix has decided to purchase production-grade hybrid bonding equipment for the development of next-generation High Bandwidth Memory (HBM).
According to industry sources on March 31, SK Hynix placed an order last month for one hybrid bonding inline system co-developed by Applied Materials (US) and Besi (Netherlands). The price is understood to be around KRW 20 billion (~USD 14 million). The inline system comprises Applied Materials' chemical mechanical planarization (CMP) and plasma treatment equipment alongside Besi's hybrid bonder. It will be installed in a development line in the near future. This marks the first time SK Hynix has purchased a production-grade hybrid bonding system.
An industry official noted, "Hybrid bonding is expected to be applied to HBM from the generation after next onward," adding, "This order is for a production-type tool, but it is a forward-looking move aimed at development."
Hybrid bonding is poised to become a core technology for next-generation semiconductor manufacturing. The essence of hybrid bonding lies in placing a chip die directly onto a processed wafer so that copper (Cu) pads are brought into direct contact. Prior to bonding, a CMP step is required for surface planarization, followed by plasma-based post-treatment under vacuum. Because copper is connected directly to copper, integration density can be increased while interconnect lengths are reduced—enabling improved device performance and lower power consumption.
Besi is widely regarded as the global leader in the hybrid bonding equipment market. In die bonding equipment specifically, the company holds a technological edge over competitors in both precision and throughput.
The fruits of the Applied–Besi collaboration are already running on TSMC's production lines. TSMC has used the equipment to commercialize AMD's 3D V-Cache technology—a scheme that vertically stacks high-speed cache memory on top of a processor, dramatically improving data access speeds required for high-performance computing. The Applied–Besi hybrid bonding inline system is also expected to be deployed for Broadcom's custom AI ASICs.
That said, the exact methodology by which SK Hynix plans to apply hybrid bonding to HBM has not been disclosed. According to industry sources, the most likely approach is die-to-wafer (D2W) bonding, where the first DRAM core die is placed onto the base die wafer, followed by die-to-die (D2D) stacking in which DRAM dies are added one layer at a time. An alternative approach is also under review: two DRAM dies would first be hybrid-bonded together at the wafer level, and these pairs would then be stacked sequentially. For a 16-high stack, this method could halve the number of stacking steps to eight.
A memory industry official said, "It has not yet been determined which method will be adopted," adding, "Various approaches will be tested to find the one that delivers optimal performance while maintaining yield."
Beyond the Applied–Besi inline system, SK Hynix also plans to bring in a hybrid bonding tool developed by Hanwha Semitech for quality testing in the near future. Samsung Electronics has likewise already introduced Besi equipment for development purposes, and has recently begun quality-testing a hybrid bonder from SEMES as well. However, the SEMES tool is understood to be less mature in terms of completeness.
$AMAT

English


過去に、長納期化した製品を扱っていた経験からお話すると、メーカーの意図として、大量発注来てるからそれを抑制するためと、注文してもすぐには届かないというメッセージでもあると思う。
営業は大変だろうなぁ。
あと、一度納期問題を起こしたら、大量発注して、各社大量に在庫が溜まって注文が来なくなる可能性有り。
としやん@toshi49e
ナフサ不足により、塗料を通常期の50%しか供給しないという通達が来たなぁ。 これ結構やばい。 #塗料 #シンナー
日本語

3月は-3%
年初来120%以上
石油資源開発が寄与したが
富士電機などの損切りが響いた。
日経15%程度下がったからよくやった方だと思うが。
#石油資源開発
としやん@toshi49e
1月は+50% 2月は+60% 年初来+130%以上 1月はローツェ 2月はユニオンツール オプトラン オプトランは最終日ストップ高 3月以降は富士電機と、明電舎に期待。 #ローツェ #ユニオンツール #オプトラン
日本語

リョービ(5851)
アルミダイキャストで有名だが
価格転嫁できないと厳しいかも
マツダ向けの自動車部品が主力
#リョービ
#アルミ
#自動車
アルミ高騰、一時6%高 中東の製錬所攻撃で供給懸念:日本経済新聞 nikkei.com/article/DGXZQO…
日本語

就活で造船会社受けたことあるが
外航船は数年に1回 塗装の塗り替えが必要で1回で数億円程度かかるとか言ってた気がする。
#造船
#塗料
としやん@toshi49e
造船業界でもかなりの痛手 #造船
日本語

月曜日このポートフォリオがどうなるか。
非常に楽しみ
としやん@toshi49e
今は、ほぼフルポジだが 石油資源開発に7割程度資金投入してる。 残りは、川崎汽船 ニーサでオプトラン #石油資源開発 #川崎汽船
日本語

THK
この決算説明資料は日本の工作機械、半導体製造装置業界動向を調査する上で非常に重要なデータ。
#THK
#半導体製造装置
#工作機械
#LMガイド
thk.com/jp/ja/ir/libra…
THK(株) 2025年12月期決算補足説明資料より


日本語


