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SK Hynix Pushes for First 'Mass Production Line' for 2.5D Packaging in the U.S. to Counter CoWoS SK Hynix is planning investments to secure overall advanced packaging technological capabilities beyond High Bandwidth Memory (HBM). It has been identified that the company has begun preparations to establish its first 2.5D packaging mass production line at its new packaging plant in the United States. 2.5D packaging is a key process for integrating HBM and high-performance system semiconductors. If SK Hynix secures 2.5D packaging technology and mass production capabilities, it is expected to bring significant changes to the AI semiconductor supply chain. According to ZDNet Korea’s reporting on the 29th, SK Hynix is discussing plans to build a 2.5D manufacturing line at its new packaging plant located in West Lafayette, Indiana. Pushing for the First Construction of a 2.5D Packaging Mass Production Line The West Lafayette packaging plant is set to be SK Hynix's first factory in the U.S. and will be established as a production base for advanced packaging for AI memory. The target operation time is the second half of 2028. To this end, SK Hynix previously announced plans to invest $3.87 billion (approximately 5.4 trillion KRW) locally. The primary factor behind SK Hynix building a new packaging line in West Lafayette lies in HBM. HBM is one of the key elements of AI semiconductors, and the U.S. government has been actively attracting local investments from major semiconductor companies, including SK Hynix, to strengthen the domestic supply chain for cutting-edge semiconductors. Furthermore, SK Hynix is pursuing a plan to build a 2.5D packaging mass production line at the plant. 2.5D packaging is a technology that inserts a thin film called a silicon interposer between the semiconductor and the substrate to enhance chip performance and power efficiency. High-performance AI accelerators from global big tech company NVIDIA are also created by integrating HBM and high-performance GPUs/CPUs using 2.5D packaging. What Does It Mean?... Strategy to Strengthen Overall Technology Beyond HBM to Advanced Packaging For this reason, SK Hynix has been conducting its own R&D on 2.5D packaging. However, it is assessed that facilities in Korea are not sufficient to conduct all 2.5D packaging processes at a mass production level. An official familiar with the matter explained, "In the case of SK Hynix, they possess the basic technology and equipment for 2.5D packaging, but it is difficult to handle large SiP (System-in-Package) equipment capable of responding to AI accelerators with integrated HBM," adding, "Accordingly, they are seriously discussing with packaging partners a plan to establish the first official 2.5D packaging mass production line in West Lafayette, U.S." From this perspective, if SK Hynix builds a 2.5D packaging mass production line, it is observed that they will be able to secure stability in the supply of next-generation HBM. Additionally, by further advancing their technological capabilities, they can conceive a Turn-Key business model providing both HBM and packaging to customers simultaneously. Currently, 2.5D packaging for AI accelerators is effectively monopolized by Taiwan's major foundry, TSMC. A semiconductor industry official stated, "Currently, SK Hynix recognizes equipping facilities to directly conduct 2.5D packaging for its own HBM as a very important task," and "If the technology stabilizes and advances, they could push for business expansion beyond simple R&D." Another official noted, "The will to expand related businesses is clear within SK Hynix, such as actively proceeding with 2.5D packaging sample manufacturing and testing," but added, "However, as there is still much time left until the completion of the West Lafayette plant in the U.S., there is a possibility that plans may be modified." In relation to this, SK Hynix responded, "We are reviewing various options regarding the utilization of the Indiana fab, but nothing has been specifically confirmed."

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