Alex

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Alex

Alex

@Alex_Intel_

🇺🇲🦅

Katılım Ekim 2013
354 Takip Edilen3.3K Takipçiler
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Alex
Alex@Alex_Intel_·
@magicsilicon New model? (2nd one has to be an acquisition)
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Alex
Alex@Alex_Intel_·
@XYang2023 @Glassesman88 @intel Biden admin only sent like $1B or $2B They agreed to like 7B, but trump admin hasn't paid any out I believe
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Alex
Alex@Alex_Intel_·
@Glassesman88 @XYang2023 @intel Main $$ of chips act was the tax credit Chips Act was a good idea, but government should have never given money to foreign companies and also needed a demand lever to get companies to buy local vs foreign Tariff threat is the demand lever
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James
James@Glassesman88·
@XYang2023 @intel How stupid was the CHIPS ACT? The point is to give them money while they are building the fab and not after
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Pushkar Ranade
Pushkar Ranade@magicsilicon·
How much candy is too much candy?
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siliconmemes
siliconmemes@realmemes6·
@Alex_Intel_ Wait, does that mean China's Air Force might not be built on the American tech stack?
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siliconmemes
siliconmemes@realmemes6·
Nvidia marketshare in China is now 0% says Nvidia CEO Jensen Huang, noting that US export policy to halt Nvidia exports to China has "largely backfired" 🤔 tomshardware.com/tech-industry/…
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Intel Pro Max Ultra
Intel Pro Max Ultra@IntelProMUltra·
1. It’s a no brainer that EMIB-T’s 90% yield is not high enough compared to TSMC CoWoS. Because it provides larger reticle size, it’s more complex and difficult to make. 2. Until 2H27, Intel still got at least 1 year to improve the yield to 98% to be ready for Google TPU Humifish’s mass production. 3. TSMC seems unlikely to win back the orders. Of course, Google wants a bigger reticle size solution, and currently only Intel is capable to provide that!
郭明錤|Ming-Chi Kuo@mingchikuo

Some quick thoughts on Intel's EMIB-T packaging for the new 2H27 Google TPU (Humufish). Based on my industry checks: 【How to read EMIB-T's 90% yield?】 1. Given Intel's track record running EMIB in mass production, hitting 90% technology validation yield on EMIB-T (still under development) is a very positive but reasonable data point. 2. Intel benchmarks EMIB production/assembly yield against FCBGA. Industry FCBGA yield today is generally above 98%. 3. On yield, getting from 90% to 98% is harder than getting from project kickoff to 90%. And technology validation yield ≠ final production yield, especially with some Humufish specs still unfinalized. So long-term, I'm positive on Intel's advanced packaging story. Near to mid-term, I'm staying cautious on how they get there. 【From 90% to 98%. Looks like just a few points. Does Google care? Absolutely】 1. Google recently asked TSMC how much it could save by placing wafer orders for Humufish's main compute die (designed in-house by Google) directly, rather than routing them through MediaTek. 2. Google and MediaTek have run a semi-COT model since day one (8t). MediaTek's mark-up sits mostly on the parts it designs itself, so whether Google places the wafer orders for main compute die directly isn't a key swing factor for MediaTek's earnings trajectory. 3. But Google even probing whether it can squeeze out the pass-through mark-up on wafer orders tells you something: Google has shifted from easygoing buyer to hard-nosed on cost. The reason is simple: to take on Nvidia head-on, cost is Google's edge, which makes EMIB-T production yield Google's problem to solve. For context, TSMC's yield target on 5.5-reticle CoWoS in 2026 also starts at 98%. 【TSMC's position】 1. My understanding is TSMC is still working out how much advanced-node capacity to allocate to Humufish in 2H27, for two reasons: (1) it still wants the back-end packaging orders, though looks unlikely for now, and that's by design on Google's part; and (2) it's still gauging actual back-end output from EMIB-T, to avoid misallocating scarce advanced-node capacity. 2. Humufish's effective back-end output hinges on both EMIB-T and substrates, and both need to be tracked together. 3. On the Humufish semi-COT model, TSMC also prefers MediaTek to place the wafer orders for the main compute die. Beyond the close working relationship, the key point is MediaTek is TSMC's third-largest advanced-node customer in 2025. If TPU orders shift, MediaTek's scale makes it a natural buffer for TSMC to rebalance its wafer allocation mix.

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Alex
Alex@Alex_Intel_·
@IntelProMUltra Whole reason Google is picking EMIB is that yields are superior on larger reticle sizes EMIB has lower cost due to not wasting so much Substrate. But mainly it's superior yields and ability to scale reticle size
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Alex@Alex_Intel_·
@jukan05 Lip-Bu is humble Always let the customer and strategic partner take the spotlight and the credit
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Alex retweetledi
Consensus Media
Consensus Media@ConsensusGurus·
*BESSENT: INTEL IS OUR NATIONAL CHAMPION $INTC
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Sean
Sean@Sean14978416·
SIG Semi-Distro channel check notes ( $INTC, $SNDK, $MRVL etc):
Sean tweet mediaSean tweet mediaSean tweet media
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Alex
Alex@Alex_Intel_·
@jukan05 The more theirs direct collaboration with Intel the better Google did prepay not Mediatek for EMIB so it's not surprising Google also wants to buy wafers directly despite TSMC not wanting that
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Jukan
Jukan@jukan05·
"But Google even probing whether it can squeeze out the pass-through mark-up on wafer orders tells you something: Google has shifted from easygoing buyer to hard-nosed on cost. The reason is simple: to take on Nvidia head-on, cost is Google’s edge, which makes EMIB-T production yield Google’s problem to solve." Very interesting...
郭明錤|Ming-Chi Kuo@mingchikuo

Some quick thoughts on Intel's EMIB-T packaging for the new 2H27 Google TPU (Humufish). Based on my industry checks: 【How to read EMIB-T's 90% yield?】 1. Given Intel's track record running EMIB in mass production, hitting 90% technology validation yield on EMIB-T (still under development) is a very positive but reasonable data point. 2. Intel benchmarks EMIB production/assembly yield against FCBGA. Industry FCBGA yield today is generally above 98%. 3. On yield, getting from 90% to 98% is harder than getting from project kickoff to 90%. And technology validation yield ≠ final production yield, especially with some Humufish specs still unfinalized. So long-term, I'm positive on Intel's advanced packaging story. Near to mid-term, I'm staying cautious on how they get there. 【From 90% to 98%. Looks like just a few points. Does Google care? Absolutely】 1. Google recently asked TSMC how much it could save by placing wafer orders for Humufish's main compute die (designed in-house by Google) directly, rather than routing them through MediaTek. 2. Google and MediaTek have run a semi-COT model since day one (8t). MediaTek's mark-up sits mostly on the parts it designs itself, so whether Google places the wafer orders for main compute die directly isn't a key swing factor for MediaTek's earnings trajectory. 3. But Google even probing whether it can squeeze out the pass-through mark-up on wafer orders tells you something: Google has shifted from easygoing buyer to hard-nosed on cost. The reason is simple: to take on Nvidia head-on, cost is Google's edge, which makes EMIB-T production yield Google's problem to solve. For context, TSMC's yield target on 5.5-reticle CoWoS in 2026 also starts at 98%. 【TSMC's position】 1. My understanding is TSMC is still working out how much advanced-node capacity to allocate to Humufish in 2H27, for two reasons: (1) it still wants the back-end packaging orders, though looks unlikely for now, and that's by design on Google's part; and (2) it's still gauging actual back-end output from EMIB-T, to avoid misallocating scarce advanced-node capacity. 2. Humufish's effective back-end output hinges on both EMIB-T and substrates, and both need to be tracked together. 3. On the Humufish semi-COT model, TSMC also prefers MediaTek to place the wafer orders for the main compute die. Beyond the close working relationship, the key point is MediaTek is TSMC's third-largest advanced-node customer in 2025. If TPU orders shift, MediaTek's scale makes it a natural buffer for TSMC to rebalance its wafer allocation mix.

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Alex
Alex@Alex_Intel_·
@Anoldoldwooden @Mar364503 You and MQ are really great at finding LinkedIn information nuggets Please keep it up!
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Alex@Alex_Intel_·
@semivision_tw Yep Analysts continue to miss this point Intel and the Foundry are inseparable. Company is worth more together than apart
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SemiVision👁️👁️
SemiVision👁️👁️@semivision_tw·
Without foundry, the Trump administration would never have invested in Intel. Intel’s real strategic value is not just CPUs, nor simply its brand. It is one of the few U.S. companies still capable of advancing leading-edge process technology and advanced packaging. Without foundry, Intel would no longer be a cornerstone of U.S. semiconductor and AI security. It would simply become another chip company gradually losing strategic relevance. But because Intel still has foundry, it holds a strategic card that even NVIDIA does not have: the ability to become a second advanced manufacturing option beyond TSMC when needed. That is why, when the Trump administration invested in Intel, it required Intel to maintain control of its foundry business. This shows that what the government truly values is exactly what Wall Street dislikes the most: Intel’s foundry. That is why I have always appreciated Pat Gelsinger. Without his insistence on pushing IDM 2.0, 18A, and 14A, Intel would not have this strategic card today. Foundry is extremely important. Without foundry, there would be no Intel as we know it today.
SemiVision👁️👁️@semivision_tw

Intel 18A-P $INTC open.substack.com/pub/tspasemico…

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Intel Pro Max Ultra
Intel Pro Max Ultra@IntelProMUltra·
After the rally in INTC stock over the past 12 months, I feel investors’ view of the company has fundamentally changed. Just 12–18 months ago, most investors expected Intel Foundry to be separated from Intel, believing that splitting manufacturing from the product business would be the best path forward. But as 18A successfully entered mass production, yields improved ahead of schedule, EMIB gained market traction, 18A-P started closing the gap with N2, and 14A was confirmed to have internal products, investors, especially “new investors,” have started to believe that Intel Foundry is Intel’s most valuable asset and what truly differentiates it from other semiconductor companies. Now the narrative is completely different. People are starting to believe in the foundry turnaround story and recognize that it is critical to Intel’s long-term success. That is a major shift in market perception. It reminds me of one Pat statement I really like: “All eyes will remain on us. We need to fight for every inch and execute better than ever before. Because that’s the only way to quiet our critics and deliver the results we know we’re capable of achieving.” — Pat Gelsinger, September 16, 2024
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Alex
Alex@Alex_Intel_·
@M_Astralplane Tesla and Intel could do R&D needed for a memory process node PSMC is getting 1Y node which is from 2017 ish (2nd Gen 10nm) from Micron But it's probably not good enough density wise. Tesla has money and could build clean room space for this project
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Planetraveller
Planetraveller@M_Astralplane·
@Alex_Intel_ Ok thanks for the additional clarification. Not sure who else they can source the memory from. From what I see Intel / University of Toyko have key enabling IP that Saimemory license for commercialization. Tesla have no play here unless Intel license z-angle tech to them...
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Alex
Alex@Alex_Intel_·
Intel ZAM is achieving 2x speeds of HBM4 and matching future speed of HBM4E Except ZAM is using a cooked up PSMC 20nm DRAM node thats 10 years old (speculation but PSMC is apart of the paper and 20nm is the best they have) Great resources in quote below for patents and paper
OGAWA, Tadashi@ogawa_tter

"Microelectronic Assemblies including Stacked Dies Coupled by A Through Dielectric Via", Stephen Morein (CTO, SAIMEMORY, Aug 2025 --), ..., Prashant Majhi, Intel (Jun 2022) patents.google.com/patent/US12525… <= VLSI 2026 x.com/ogawa_tter/sta… ZAM、4月22日 x.com/ogawa_tter/sta… 38億円🤔

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