kokycpcb
84 posts

kokycpcb
@pcbanalysis
Senior PCB Industry analyst in Taiwan. Our team offers unmatched expertise in executing deep-dive, fundamental analysis of the global PCB supply chain.




What's happening in the MLCC market First off, MLCC as a whole is a $15B market. MLCCs for servers were a $1.3B market in 2025 ($600m for AI servers, $700m for general servers) The AI server MLCC market is growing at 80%+ CAGR, and the general server MLCC market will also accelerate due to agentic AI increasing CPU demand (around 30%-40% CAGR) We will see negative growth in the smartphone/mobile MLCC market for at least 2026-27. Humanoids are another future high-growth market for MLCCs Book-to-bill ratio for most MLCC suppliers is over 1 now Reasons for price hikes- High Nickel & Silver are affecting all segments There is a supply-demand mismatch in the high-end (high capacitance, high voltage) segment, which is used in autos & servers High-end MLCC lead time is over 20 weeks Spot/distributor prices have increased by 20%-40% for low capacitance & consumer device MLCCs due to hoarding and double booking, especially in China OEM contracts have not seen large price hikes yet What's happening now: Rapid capacity expansion happening across the industry Murata expects blended ASP prices to remain flat (ASP going down in consumer electronics, expansion in AI server market) Tier 1 players like Murata, Taiyo Yuden, SEMCO building capacity to serve AI server MLCC market This will create opportunities for Tier 2/3 and Chinese suppliers to expand in the mid to low end market (Macronix effect) Future: MLCC production equiment & raw materials suppliers will be the biggest beneficiary of this CAPEX boom MLCC producer stocks have performed well, and it is finally spilling to raw material/equipment producers I expect them to outperform MLCC producers now




三井金屬 2026年6月11日 各位 關於本公司銅箔事業相關部分報導等事宜 最近,關於本公司的銅箔事業,有韓國系企業參與導致競爭激化、玻璃基板採用等因素,使得本公司銅箔「可能不再被使用」等以亞洲地區為中心的各種報導與傳聞,但其中散見與事實不符的內容。 一如以往,本公司銅箔事業的經營環境及中長期的成長展望並無重大變化。 本公司正極力推動高周波基板用電解銅箔 VSP™ 及極薄銅箔 MicroThin™ 的中長期成長,並已開始檢討進一步的增產投資。今後也將進一步強化本公司的優勢,致力於中長期企業價值的提升。 mitsui-kinzoku.com/LinkClick.aspx…





PCB是所有電子產品的核心基板,卻幾乎隱形存在。在 AI 熱潮中,Nvidia 等大廠的高階 AI 伺服器電路板,絕大部分由中國製造,全球約 60% PCB 產能來自中國,美國本土市占率已從過去 30% 暴跌至僅 4%,形成嚴重國家安全風險。 中國製 PCB 可能被植入惡意元件,導致資料外洩、系統效能降低,甚至飛彈導引失靈。美國國防部因此高度警覺,要求關鍵採購必須來自國內。國防官員警告,這是最容易被破壞的供應鏈環節。 為解決危機,美國國會兩黨正推動《保護電路板與基板法案》,提供選擇美國製 PCB 的企業 25% 稅務抵免,並擬撥款 30 億美元補助本土廠商。 $TTM Technologies 與 Sanmina 這兩家美國上市 PCB 廠商,正加速擴張國內產能:TTM 將在紐約州與威斯康辛州新建大型工廠,完工後美國將擁有 18 座廠。 AI 需求爆炸性成長,導致 PCB 價格大漲 5%~40%,TTM 執行長表示「晶片不會漂浮」,所有先進晶片都必須靠高階 PCB 才能運作。儘管 Nvidia 已透過 X 光與 AI 檢測降低風險,但供應鏈過度依賴中國仍被視為重大漏洞。 在美中科技戰升級之際,此議題凸顯美國重建關鍵電子供應鏈的急迫性。專家呼籲,唯有發展具競爭力的本土 PCB 產業,才能確保 AI 與國防科技的長期安全。 cnbc.com/2026/06/03/ben…





Computex 2026:Agentic AI 時代來臨 Vera CPU 與 Agent Toolkit 為 NVIDIA 布局 Agentic AI:在 Oracle 大單支持下,GF認為 NVIDIA 單獨 Vera CPU 的年營收可見度達到 200 億美元是合理的。 ⇒ Vera CPU 供應鏈:景碩科技、AMKR Vera Rubin 系列用於 AI Agents:NVIDIA 宣布 Vera Rubin 平台已進入量產,預期 Rubin Sept 將在 9 月、Vera Rubin NVL72 將在 10 月進入大幅拉貨階段。 NVIDIA RTX Spark 為 AI Agent PC 提供動力:GF相信這將擴大 NVIDIA 在 AI PC 市場的地位,但由於 ARM 相容性持續存在問題,仍將屬於利基市場,對 Intel 與 AMD 的影響有限。 ⇒ 根據GF先前的報告,預期 NVDA 不僅與 ARM 合作,也會與 Intel 合作。 NVIDIA 財務分析師 Q&A 會議:NVIDIA 宣布將返還至少 50% 的自由現金流。管理層認為 Vera CPU 是開拓全新市場,而非搶奪既有市占,其 CPU 長期出貨量機會將超過 GPU。 Intel 在 18A 良率良好下恢復 CPU 重要性,已有 3 款 CPU SKU 進入量產。

Abstract of Our PCB Note -> PTFE Likely Chosen for Nvidia Kyber Midplane ✅ Key Highlights: •PTFE likely be selected over M9+Q glass for superior high-frequency performance & lower signal loss •PTFE supports 337G+ SerDes requirements •PTFE has solved past rigidity/drillability issues Market Impact: •PTFE CCL market projected to hit RMB 8bn in 2027 for Kyber •Further ramp expected in Feynman platform •Mass production likely starts late 2026 due to manufacturing complexity Stock Beneficiaries: •Shengyi Tech (600183 CH) •TPE 台虹 (8039 TT) •Upstream: Dongyue Group (0189 HK) — main PTFE supplier to Shengyi •Others: Daikin (6367 JP), Haohua Chemical (600378 CH) Solid long-term tailwind for PTFE supply chain. #NVDA #Kyber #Midplane #正交





