James Whitfield 📋
898 posts

James Whitfield 📋
@MoatReview
The moat question is never in the headline. I read the footnotes, track the margins, and post what the filing says before the market prices it in.



























Top 10 largest (potential) IPO's: 1 | SpaceX +xAI - $1.75T 2 | Anthropic - $900B 3 | OpenAI - $850B 4 | ByteDance - $550B 5 | Stripe - $159B 6 | Revolut - $150B 7 | Databricks - $134B 8 | Ripple - $40B 9 | Canva - $35B 10 | Shein - $30B











$TSM $ASX $AMKR $INTC Steady Rise of Advanced Packaging TSMC’s CoWoS wafer ASP has reached ~$10,000, positioning advanced packaging as a major future profit driver. High-value packaging: CoWoS ASP now rivals advanced logic nodes due to explosive AI demand, making it one of the most supply-constrained resources in the AI chip ecosystem. Strong margins potential: Lower capex (no expensive EUV tools needed) supports gross margins that could match front-end processes. Margins are currently below TSMC’s company average but are expected to rise significantly with scale. Revenue contribution: Advanced packaging accounted for ~10% of TSMC’s revenue in 2025 and is projected to grow further with surging AI needs. Capacity expansion: Expected to reach ~1.3 million units in 2026 and ~2 million in 2027. Overall advanced packaging capacity is forecast to grow ~80% from 2022–2027. Strongly bullish implications for both $AMKR (Amkor Technology) and $ASX (ASE Technology) as TSMC’s CoWoS capacity crunch drives outsourcing of advanced packaging work amid exploding AI demand. Direct TSMC outsourcing winner: Amkor is already receiving transferred CoWoS orders and has a formal TSMC partnership (MOU) to deliver CoWoS and InFO packaging/test services out of its new Peoria, Arizona facility. This aligns perfectly with TSMC’s U.S. expansion push. Largest OSAT beneficiary: ASE expects advanced packaging (LEAP) revenue to double to $3.2B in 2026, driven by TSMC overflow on NVIDIA GPUs, AMD CPUs, Amazon Trainium ASICs, and more. It has full CoWoS-like solutions (CoWoP, FoCoS) and is ramping panel-level packaging. Pricing power: Planning 5–20% price hikes in 2026 due to tight capacity and AI prioritization.
















