Semiconductor Engineering

Special Report: Inspired by HBM, HBF could improve AI efficiency in 3D flash memory. semiengineering.com/flash-getting-… #HBF #HighBandwidthFlash #HBM #AIinference #NVM #CIM

Taller high-bandwidth memory (HBM) stacks and tighter TSV pitch are impacting AI module yields. The solution is to push test further left in the manufacturing flow, but that shift comes at a cost. semiengineering.com/hbm-shifts-tes… #HBM #semiconductor #DFT #TSV

Multi-die assemblies greatly increase the number of things that can go wrong, and the difficulty of finding them. semiengineering.com/ai-accelerator… #semiconductor #AIchips #DFT #semiconductortest #HBM #multidieassemblies

Battery management systems are growing increasingly smarter with innovations in SW and HW that enable more accurate estimation of battery state of charge and health, along with predictive diagnostics. semiengineering.com/next-gen-batte… #BMS #batterymanagementsystems #EVs

Latest: M&A; GF’s CPO solution; Apple looks beyond TSMC; EU chip map; earnings; MIT’s new lidar chip; AI inferencing at sea; quantum HW $; PCIe 7 tool; home data centers; AI security warnings; temperature impact on EVs... semiengineering.com/chip-industry-… #semiconductor #quantum #EVs

New CPU Memory Module: Benefits and questions surrounding a next-gen low-power standard for high-performance compute. semiengineering.com/new-cpu-memory… semiengineering.com/new-cpu-memory… #SOCAMMs #DD4 #lowpowermemory #datacenters #datamovement #HPC #thermalmanagement @Cadence @FrankFerro5

The semiconductor ecosystem is wrestling with fragmented standards, IP exposure, and the urgent need for runtime assurance. semiengineering.com/building-ai-wi… #semiconductor #AI #AIsecurity

Special Report: Humanoid Touch And Voice Are Improving Rapidly General-purpose humanoid robots need all their senses to function equally well; vision and movement are the farthest along, but others are catching up.semiengineering.com/humanoid-touch… #humanoids #robots

AI agents can be used to identify potential issues during operation and react before it’s too late. semiengineering.com/using-ai-to-mo… #semiconductor #semiEDA #agenticAI

Current approaches involve multiple tools, vendors, designs, data formats, and abstractions. Can agents really use them all? semiengineering.com/creating-agent… #semiEDA #agenticAI #semiconductor #HLS

Long‑running agents, tool-calling LLMs, and multimodal chaos are rewriting edge compute rules, and making chip design more challenging. Final in series w/9 industry experts semiengineering.com/designing-chip… #semiEDA #LLMs #agenticAI #EdgeAI

Latest: Google’s TPUs now for sale; 2/3nm capacity crunch; IC tool sales to China stopped; memory shortage widens in 2027; mega-earnings; Intel seeds universities; liquid cooling for adv. packages; MIT-IBM tool for estimating power.. #semiconductor semiengineering.com/chip-industry-…

Why Proof Convergence Matters Leveraging patterns in formal verification to reach sign-off faster. youtu.be/EEsCDMSRKoY?si… #semiEDA #verification @axiomise #coverage

But the inability to utilize leading-edge process nodes has created opportunities for small and midsize chip developers in multi-die design, along with some sophisticated architectural design tradeoffs. semiengineering.com/foundries-capa… #semiEDA #semiconductor #foundries #2nm #3nm

As models evolve faster than silicon cycles, experts weigh how much adaptability architects can afford without sacrificing power, area, or efficiency. Part 2 semiengineering.com/can-edge-ai-ke… #EdgeAI

Chiplet Standards Aim For Plug-n-Play semiengineering.com/chiplet-standa… #chiplets

The gap between lab performance and fab reality is growing wider as packages grow more complex. semiengineering.com/when-semicondu… #semiconductor #materials