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Austin

@YoArmstrong

investor. tech enthusiast. $HOOD. $BTC. $TSLA. Sun Devil 🔱 #ForksUp #DaBears

Arizona, USA Katılım Ağustos 2011
1.3K Takip Edilen763 Takipçiler
Austin
Austin@YoArmstrong·
@grok @StockSavvyShay Who has the most capacity or can add capacity quickest in this timeframe?
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Grok
Grok@grok·
**SK Hynix ($Hynix or equivalent) edges it out as the strongest 5-year play right now.** It's the clear HBM leader with massive market share, already-booked multi-year supply to Nvidia and others, and sky-high margins from AI demand. Samsung has scale but is more diversified; MU is a solid US pure-play with booked capacity but trails in HBM leadership; SNDK is crushing it on NAND/storage but that's secondary to the HBM bottleneck. All benefit from the memory supercycle through 2027+, but Hynix's position gives it the most torque at current levels. (Not financial advice—DYOR.)
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Shay Boloor
Shay Boloor@StockSavvyShay·
THE BIG 4 MEMORY PLAYERS As models & agents get more compute-intensive, memory is becoming one of the clearest bottlenecks in the AI stack which is why the Big 4 matter so much here: 1. Samsung is the largest memory player at $897B market cap that just printed 8x YoY operating profit growth with HBM4 mass shipments to $NVDA for Vera Rubin & shortage warnings through 2027. 2. SK Hynix is the current HBM leader at $498B market cap with leading global HBM market share that just printed 72% operating margins & three-plus years of HBM commitments already booked. 3. $MU is the cleanest U.S. memory winner at $481B market cap with entire 2026 HBM supply already booked across six customers including $AMD & $AAPL & FY26 capex raised to $20B to expand the HBM advanced packaging facility in Singapore. 4. $SNDK is the NAND comeback story at $141B market cap that just printed ~$4.1B in single-quarter operating profit at 78% gross margins exceeding the cumulative operating profit across the prior three years combined.
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VanquishTrader@VanquishTrader

TOP 4 LARGEST MEMORY CHIP MAKERS 1. Samsung ($897B) 2. SK Hynix ($498B) 3. $MU ($481B) 4. $SNDK ($141B)

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Graham Rossini
Graham Rossini@GrahamRossini·
Incredible news below! We’re so thankful for Brian & Kelly Swette for their gift in support of Coach Dillingham & ASU Football. This gift will inspire others & is the latest example of Sun Devils stepping up! $10M gift to endow ASU head football coach news.asu.edu/20260501-unive…
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R A W S A L E R T S
R A W S A L E R T S@rawsalerts·
🚨#BREAKING: Watch as Alex Jones signs off from Infowars after 27 years on air, delivering a final, defiant farewell saying We commit ourselves to God in this holy fight. We are committed and if God stands with us, who can stand against us? God bless you and let the real war begin.
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Trade Whisperer
Trade Whisperer@TradexWhisperer·
$INTC Intel has achieved a major milestone with its EMIB advanced packaging technology, hitting ~90% yield, which analysts view as a significant foundry breakthrough and a competitive edge against TSMC’s CoWoS which is COMPLETLY MAXED OUT. -EMIB-M: Focuses on efficiency with MIM capacitors for better power delivery and noise reduction. -EMIB-T: Adds TSVs (Through-Silicon Vias) for direct power routing through the bridge, enabling higher performance for AI accelerators. It supports easier integration of IP from other packaging designs and is optimized for high-bandwidth memory (HBM). -Current/near-term (EMIB-T): >8x reticle size in 120x120mm packages, supporting 12 HBMs, 4+ dense chiplets, and >20 bridges. -By 2028: Scales to >12x reticle size in >120x180mm packages, with >24 HBM dies and >38 EMIB-T bridges. EMIB is gaining traction with hyperscalers: Google is reportedly using it for next-gen TPUs (e.g., TPUv8e), NVIDIA for Feynman chips, and Meta for a future CPU (late 2028). It strengthens Intel Foundry’s position in the AI packaging race. Advanced Packging is the Moore's Law Going Vertical.
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Trade Whisperer@TradexWhisperer

$TSM Advanced packaging capacity is maxed out. $INTC Intel's advanced packaging business is gaining interest as an alternative to TSMC especially in the AI chip segment. Google and Amazon are in active discussions with Intel for advanced packaging services for their custom ASICs with potential adoption of Intel's EMIB or next generation EMIB T technology for Google's TPUs and Amazon's Trainium chips. Customer commitments for these packaging deals are expected in the second half of 2026 with possible updates at Intel's earnings call on April 23. Intel CFO David Zinsner noted that customers are ready to commit and even prepay with potential deals reaching billions of dollars describing advanced packaging as now the more interesting and higher margin part of the foundry business with gross margins around forty percent. The interest stems largely from TSMC's constrained advanced packaging capacity which remains heavily concentrated in Taiwan creating supply security concerns for hyperscalers. Intel is actively expanding its packaging capacity including a new Malaysia complex set to become operational in 2026 for assembly and testing and its New Mexico fabs already in mass production of advanced 3D packaging since early 2024. EMIB T the upgraded version of Intel's embedded multi die interconnect bridge technology adds through silicon vias for better power delivery and signal integrity and is designed to support very large AI packages. TSMC is responding by building its own advanced packaging facility in the United States with construction starting in the second quarter of 2026 and operations targeted for late 2027 to 2028. This development highlights growing momentum in Intel's foundry turnaround as it leverages packaging strengths to attract major AI customers amid tight industry capacity.

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Austin
Austin@YoArmstrong·
The president is pumping $intc and you aren’t bullish?
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Austin
Austin@YoArmstrong·
@GerberKawasaki Pretty sure they’d have no customers left that way. How do you explain the growth then? Based on your ETFs return, your investors only lose!
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Shay Boloor
Shay Boloor@StockSavvyShay·
$AMD CEO Lisa Su met with Commerce Secretary Howard Lutnick today as AMD continues pushing deeper into America’s AI leadership buildout. Another reminder that AI infrastructure is increasingly becoming a national competitiveness priority.
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Dr. BP | Metabolism 2.0
Dr. BP | Metabolism 2.0@DrBPHealth·
𝗧𝗵𝗲 𝗩𝗶𝘁𝗮𝗺𝗶𝗻 𝗗 𝗗𝗲𝗰𝗲𝗽𝘁𝗶𝗼𝗻 "Your Vitamin D is 32. That's normal." Wrong. 30-100 is the "reference range" — not the optimal range. For immune function, bone health, and inflammation control, you want 50-99 ng/mL minimum. And if you have an autoimmune disease, research from June of 2025 showed you can't over come it without levels above 80 ng/mL. Most Americans are walking around at 20-40. And wondering why they're always sick, tired, and inflamed. Test yours. Supplement accordingly. (I use 6,000 IU's daily) This one change can transform health outcomes.
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Sean OMara MD, JD
Sean OMara MD, JD@DrSeanOMara·
At 24 hours of fasting, autophagy begins. At 36 hours, it triples. At 72 hours, it maxes out. If you have never fasted past a single meal skip, your body has never run its own cleanup cycle. Not once. Not in years. The heart fat, the visceral fat, the dead tissue — it is all still there because you never gave your body permission to burn it. You need to fast, and you need to make it a habit.
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Austin
Austin@YoArmstrong·
@jimcramer Only one of those 3 companies is producing anything
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Jim Cramer
Jim Cramer@jimcramer·
In 13 months Lip Bu Tan Took intel from a possible and unthinkable bailout candidate to one of the wealthiest companies in the chip industry. There is a big 3 of CPUs, AMD, Intel and ARM... and the agents need far more CPUs than these three can produce..
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