Austin
7.3K posts

Austin
@YoArmstrong
investor. tech enthusiast. $HOOD. $BTC. $TSLA. Sun Devil 🔱 #ForksUp #DaBears

Breaking: @AlexKatouzian has left Qualcomm and joined @Intel as EVP of the Client Computing and Physical AI Group (CCAI?), reporting direct to CEO @LipBuTan1. Jim Johnson and Mike Hurley will report direct to AK. Also: @magicsilicon moves permanently to CTO. Congrats dude! #INTC




TOP 4 LARGEST MEMORY CHIP MAKERS 1. Samsung ($897B) 2. SK Hynix ($498B) 3. $MU ($481B) 4. $SNDK ($141B)



$AAPL Apple CEO Tim Cook says iPhone faces advanced node chip supply constraints - Reuters

🇺🇸 U.S. oil exports hit a record 6.4 million barrels per day



$TSM Advanced packaging capacity is maxed out. $INTC Intel's advanced packaging business is gaining interest as an alternative to TSMC especially in the AI chip segment. Google and Amazon are in active discussions with Intel for advanced packaging services for their custom ASICs with potential adoption of Intel's EMIB or next generation EMIB T technology for Google's TPUs and Amazon's Trainium chips. Customer commitments for these packaging deals are expected in the second half of 2026 with possible updates at Intel's earnings call on April 23. Intel CFO David Zinsner noted that customers are ready to commit and even prepay with potential deals reaching billions of dollars describing advanced packaging as now the more interesting and higher margin part of the foundry business with gross margins around forty percent. The interest stems largely from TSMC's constrained advanced packaging capacity which remains heavily concentrated in Taiwan creating supply security concerns for hyperscalers. Intel is actively expanding its packaging capacity including a new Malaysia complex set to become operational in 2026 for assembly and testing and its New Mexico fabs already in mass production of advanced 3D packaging since early 2024. EMIB T the upgraded version of Intel's embedded multi die interconnect bridge technology adds through silicon vias for better power delivery and signal integrity and is designed to support very large AI packages. TSMC is responding by building its own advanced packaging facility in the United States with construction starting in the second quarter of 2026 and operations targeted for late 2027 to 2028. This development highlights growing momentum in Intel's foundry turnaround as it leverages packaging strengths to attract major AI customers amid tight industry capacity.

Now you can get coffee during your $UBER ride Uber is launching a new feature called “Eats for the Way” where Uber Black riders can add coffee, tea, or a snack after confirming their ride. The driver picks it up on the way. Launching in the coming weeks in: Atlanta Austin Los Angeles Philadelphia San Diego San Francisco Honestly not a bad idea.

$AMZN CEO: "If our chips business was a standalone business and sold chips produced this year to AWS and other third parties as other leading chip companies do, our annual revenue run rate would be $50 billion. As best as we can tell, our custom silicon business is now one of the top three data center chip businesses in the world. And the speed at which we've gotten here is extraordinary"

They only make money when you gamble and lose on.... stock options, crypto and betting. This is a gambling app, nothing more. They make money when you lose. $hood


Robinhood stock falls 9% after reporting weaker-than-expected earnings.





