kata
249 posts

kata
@kalocide
🂱 something divine, something stolen 🃉
Katılım Temmuz 2024
400 Takip Edilen569 Takipçiler

@eevblog @blind_via if poly-fr4 vias were commercially available in the 80s then i'd be thoroughly surprised! i'd consider that to be what seperates a rigid-flex process from just sticking a rigid board to a flex board. i agree with you that it doesn't matter where in the stackup the poly layer is
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@eevblog @blind_via as far as i'd known, fabs could bond PI boards to FR-4 boards with adhesives for a long time, but that process had no means to electrically connect the two boards. you'd have to either wrap a connector around or leave voids in the adhesive for matching solder pads to mate
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@eevblog @blind_via this kind of nonplanar stackup is exceptionally hard to pull off; it wasn't viable at all until the early 2000s, and not commercially available until very recently. they are unusual and v fascinating to see!
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@eevblog @blind_via rigid-flex stackups will have a PI rather than FR-4 core and then laminate both coverlay and prepreg to it in different spots, depending on whether the section is supposed to be flexible or rigid

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@ScottCircuitguy @blind_via it's not that you should assume manufacturers are stupid; but that you also shouldn't assume they know better than you
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@ScottCircuitguy @blind_via manufacturers don't know how your fab's materials or processes behave, what your use-case requires, or often times what is optimal for their own parts
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