Synopsys

What does it take to build the silicon backbone of the AI economy? We are pleased to welcome Sassine Ghazi, President and CEO at @Synopsys, to #RAISESummit. At the helm of a multi-billion-dollar company, Sassine leads the infrastructure layer powering the world's most consequential technologies, across silicon design, IP and simulation and analysis solutions. Trusted by industry leaders including, @AMD, @awscloud, @Intel, @Microsoft, @NVIDIA, @Tesla, and others, Synopsys is a mission-critical partner to semiconductor and systems customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow. Semiconductors are no longer just a sector. They are the bedrock upon which every AI breakthrough is realized. Sassine sits at the vital intersection where silicon meets systems and where R&D capability becomes a decisive competitive advantage. Sassine joins the mainstage at RAISE Summit 2026 on July 9 to discuss the future of AI across silicon, systems, and human innovation. Where visionaries and AI converge. #RAISE2026 #RAISESummit #AIInfrastructure #Synopsys

Apollo proved we could reach the Moon. 🌙 Artemis shows how far engineering has come. Today’s missions are powered by intelligent systems, advanced simulation, and seamless integration — from #SilicontoSystems. Explore the next era of space exploration: bit.ly/4no2HuH

Our mission is to empower innovators to drive human advancement. And that advancement involves re-engineering how next-gen, AI-powered products are designed & delivered. Hear from our CEO Sassine Ghazi as he outlines our AgentEngineer technology: bit.ly/4wtg7K6

Congratulations to this year’s #PCISIG Chairperson’s Award Winner Paul Cassidy (@Synopsys) for his continued contributions to #PCIe technology. Read more about the PCI-SIG Chairperson’s Award > bit.ly/4tTkRqI

As AI infrastructure scales, open interconnects matter more than ever. Join the UALink Consortium’s fireside chat on insights from the latest ecosystem white paper, including market drivers and accelerator connectivity. Register now: bit.ly/48R4Nx4

To meet the rising performance and power‑efficiency demands of #genAI and physical AI workloads, we introduced the enhanced version of our silicon‑proven ARC® NPX6 NPU IP family for AI‑driven SoCs: bit.ly/4tjxCtq

The #SDV era is reshaping the automotive value chain. Download our e-book for practical ways to accelerate development & control cost through early architecture alignment, virtualization & automated validation: bit.ly/4dgvrB0

What role does the #DigitalTwin really play in modern engineering? While AI dominates the conversation, digital twins are transforming how products are designed, tested, and optimized. The global digital twin market is projected to grow from $35.82 billion in 2025 to $328.51 billion by 2033. A custom study from @Synopsys Inc explores how digital twins are being applied across industries and how emerging technologies are accelerating their impact. See how engineering teams are putting digital twins to work, and how solutions from Ansys, part of Synopsys, support them. 👉 Explore the findings and real-world applications at bit.ly/48BZQbq

AI infrastructure is evolving fast — and advanced packaging with die-to-die connectivity is critical to boosting AI performance while lowering TCO. See how the Synopsys 3D ecosystem is unlocking new possibilities with 3DIO PHY: bit.ly/42Aa3lj

3D multi-die chip designs need strong interconnects — making interface IP crucial. Discover how our proven, 3D-ready interface IP enables scalable multi-die systems and solves key challenges: bit.ly/4emdYJs

With our 64G UCIe IP tape-out, we're pushing high-speed connectivity further — tackling signal integrity, power, packaging & more. Learn what it takes to design at 64G UCIe: bit.ly/4tMbBUY

Ready for next-gen design closure? Learn how RedHawk-SC enhances EMIR and IR-aware analysis for better timing & reliability. Register now: bit.ly/4upbOxA

At @Synopsys Converge this year, @Sallywf and I were invited to present our AI Hardware Show on the road (aka, the Roadshow) as an amuse bouche ahead of the CEO keynote. We discussed key milestones from 2025, and what we're looking forward to in 2026. youtu.be/WBmP_dtVR3M

Achieving two 3DIC tape-outs in just 7 months is no small task. Hear from Paul Little at @SocionextUS about what it takes, with TSMC SoIC and Synopsys tools powering the way. More here:  bit.ly/4w0WYyD

Designing an AI chip isn’t just hard — it’s one of the most complex engineering challenges of our time. We released a 3‑part white paper series that breaks down every major phase of AI silicon development: bit.ly/4eJg0U4

Are you running a marathon this year? 🏃 The position you're running in matters. In a well-positioned group, a marathon runner could experience up to a 90% reduction in aerodynamic drag, conserve energy and improve their time.    By applying aerospace technology to performance sports, a new study led by Heriot-Watt University and @Synopsys shows how, under the right aerodynamic conditions, runners could improve their race time by 30-40 seconds.    Good luck to all the runners at #LondonMarathon this weekend!     Learn more about the aerodynamic findings researchers produced with help from Ansys Fluent and Ansys Discovery: bit.ly/4ufbq4F

🗓️Save the Date: $SNPS to report Q2 FY’26 financial results on Wednesday, May 27. Register for the earnings webcast: bit.ly/41VFUwr

Quantum won’t just run software. It will redesign engineering. We discussed with @prithbanerjee, SVP of Innovation at @Synopsys, how they are: • Helping build quantum computers • Using quantum to solve NP-hard chip design problems Full interview: youtu.be/G29Z_D5oIgE

Through the #SARAProgram, Synopsys & TSMC are giving universities access to FinFET design resources, Foundation IP, and industry-ready training—shaping the future of IC design. Request access: bit.ly/4mWsPwz

Multi-die design is changing the future of chipmaking. Discover how RedHawk-SC Electrothermal helps engineers solve power, thermal, and mechanical challenges in multi-die systems. Register for the Synopsys webinar: bit.ly/4mLCo0Z