Roy Pranata Pandi

@parsashahabi0 lol😂😂 this cracked me up so badly, play it safe man, just take money printers own calls on market he shares in his TG group, you’ll be safe that way, it’s been helping me too t.me/MPCYCLE

@MoneyPrinter0x Love hearing Korean opinions and doing the reverse on investments

most normal korean equities investor

@MarkJ104058 If I’m not mistaken I’m very sure jake made an article on his TG channel In regards to it and how you can be more secure t.me/DAGFAMILYOFFIC…

@beyond_broke What is your preferredmethod for secure storage at this point? I ask because nothing seems safe anymore, and the crypto space seems to be crawling with scammers and fraud.

If you think the IRS can't find your crypto, read this. Mastercard already built tech to trace any transaction across any chain back to the wallet that bought or mined it, live since 2024. 'On-chain' was always the opposite of anonymous. Report it.

@Colosteve2000 Definitely, couldn’t have said it better, been paying attention on Jukans recent post about TSMC in his TG and if there’s anything I’ve learned is that it has good potential t.me/JUKANTG

Obviously, TSMC is feeling pressure from Intel and Samsung, TSMC's caution-to-acceleration shift makes sense, pressure from Nvidia pressure from Intel/Samsung breathing down their neck. Intel has been at this for over a decade and has a pilot line in Arizona; Samsung Electro-Mechanics is moving fast with a 2025 pilot also Sumitomo JV. TSMC partnering with Ibiden (already critical for NVIDIA/AMD substrates) and Innolux shows they're building the ecosystem aggressively. Biggest remaining hurdles as indicated :Through-Glass Vias (TGV) — forming, copper fill quality, and reliability at scale. Brittleness and micro-cracks during processing. Proving it at volume and competitive cost. If anyone has the engineering department and money to catch up quick its TSMC!!

TSMC Teams Up with Ibiden and Innolux to Push CoPoS — Reportedly Flooring the Accelerator in Glass Substrates To meet robust AI chip demand, TSMC is not only ramping CoWoS advanced packaging capacity but has, for the first time, disclosed progress on its "glass substrate" technology. The company further signaled that the next-generation advanced packaging battle is gradually shifting from CoWoS to CoPoS (Chip-on-Panel-on-Substrate), as it moves to build out a complete ecosystem ahead of the curve. According to equipment-side sources, TSMC recently shared a "Glass Substrate Development for CoWoS" program with its supply chain. It has confirmed a partnership with ABF substrate giant Ibiden and panel maker Innolux to jointly validate the feasibility of introducing glass substrates into next-generation CoWoS advanced packaging. The aim is to address the warpage, thermal management, signal transmission, and power delivery challenges that loom over future large-die AI chip packaging. At the same time, the move reflects rapidly intensifying customer demands around technical specifications and capacity, as well as mounting competitive pressure from Intel and Samsung Electronics. That pressure has finally pushed TSMC—long known for advancing R&D on a "cautious, not aggressive" basis—to step on the accelerator. Glass substrates are viewed as a key technology for the "post-CoWoS era" thanks to their low warpage, low thermal expansion, high rigidity, and excellent signal and power-delivery characteristics. Supply chain sources say the three-way collaboration among TSMC, Ibiden, and Innolux, together with simulation validation, has shown that glass substrates can improve the package-warpage indicator COP (Chip on Package) by 16%, lower the effective coefficient of thermal expansion (Effective CTE) by 19%, and raise the effective modulus (Effective Modulus) by 31%. On power integrity, resistance fell by 27% and inductance by 42%. Overall, introducing glass substrates can deliver a marked improvement in package performance (PKG Improvement). TSMC nonetheless stressed that continued research and validation are still needed on glass thickness (Glass Thickness) and large-size CoWoS layout (Large-size CoWoS Layout). While full-scale mass production remains some distance away, this marks the first time TSMC has publicly disclosed joint glass-substrate validation results with Ibiden and Innolux—signaling that glass substrates have formally entered the industrialization-validation phase. Industry observers added that the 16% COP improvement indicates package warpage is being effectively controlled. As AI GPU dies grow ever larger—with NVIDIA's GB200, GB300, and the now-ramping Rubin platform all expanding in package size—the importance of package flatness and warpage control has risen sharply. The performance glass substrates show in reducing warpage should help lift the yield and reliability of large packages. In addition, the 19% reduction in SBT effective CTE shows improved matching between the glass material and the silicon die. Today, silicon's CTE differs substantially from that of conventional organic substrates, making it prone to stress under temperature swings that can compromise package reliability. By contrast, glass has a CTE closer to that of silicon, which helps reduce thermal stress and mitigate cracking and solder-joint fatigue. The 31% gain in effective modulus means higher overall rigidity, providing better structural support. In particular, as HBM stack heights keep increasing, substrate rigidity is becoming a critical condition for supporting large packages. The test sample TSMC used this time featured a 0.8mm glass core substrate, a package spec of 5x reticle CoW, and an overall package size of 85×110mm—an AI GPU package-class footprint. TSMC specifically emphasized "No SeWaRe (severe warpage) & Delamination," meaning no severe warpage or delamination/peeling—both yield killers—occurred during testing. For glass substrates, material bonding reliability has always been a key challenge, so maintaining a stable structure at large package sizes demonstrates considerable progress in technical maturity. Another focus of the program was the comparison between Glass-SBT and Organic-SBT. TSMC noted that Glass-SBT achieves "thin but better COP," whereas Organic-SBT shows "thick but worse COP"—glass substrates can stay thinner while simultaneously improving package flatness and reliability. The partner roster also hints at the direction of the future supply chain. Ibiden currently sits in the critical substrate supply chain for NVIDIA and AMD AI chips and is regarded as a key player in industrializing glass substrates. It previously announced a ¥500 billion investment to expand its new Ono plant in Gifu Prefecture, dedicated to high-end packaging substrates for AI servers—underscoring its strong ambitions in the AI advanced-packaging market. Innolux's inclusion on the partner list is likewise seen as an important step toward staking out the next-generation glass-substrate battlefield. Industry sources say the biggest challenge for glass substrates is not the glass itself but Through Glass Via (TGV) technology. Because glass is fundamentally an insulator, tens of thousands of TGVs must be formed to create vertical conductive paths before signal and power transmission becomes possible. Glass is also both hard and brittle, making it prone to micro-cracks during processing that can affect reliability and yield. As a result, via forming, copper-fill quality, and long-term thermal reliability are considered the three core hurdles to mass-producing glass substrates. Separately, Intel began investing in glass-substrate R&D more than a decade ago and is regarded as the earliest and deepest player globally. Its glass-substrate pilot line in Arizona is gradually moving toward commercialization, and Intel is aiming to win AI GPU and ASIC customer orders through glass substrates and ultra-large chiplet packaging. Samsung Electro-Mechanics (Semco) established a glass-substrate pilot line in 2025 and has set up a joint venture with Japan's Sumitomo Chemical group to build out a glass-substrate supply chain ahead of the market. $TSM

@scratches2k5 Saw oddstats own posts in regards to it earlier on his TG, not really surprised that it’s not performed brightly, but from odd stats latest post it looks like it could perform well in the nearest future t.me/OddstatsTA

@OddStats Also, I don’t think $QQQ has had two 3% days within a 5day period in a very very long time? Just off the top of my head.

@Patrick112244 Well from the article he wrote about it earlier on his TG group, that seems to be the case t.me/DAGFAMILYOFFIC…

@beyond_broke Does this go for ZKP too?

@NexstoneTrading Couldn’t have said it better, got into it th moment he listed it out on his TG group, an it performed just as he predicted he’s definitely a money printer t.me/MPCYCLE

@MoneyPrinter0x The definition of a money printer.

good day bros

@cholevovo I do hope it goes as cheddar has said on his TG channel so we can gain massively from if t.me/CHEDDARFLOWTA

@CheddarFlow $AMD

These $MU & $AMD whales are now up MILLIONS in just 1 trading day They loaded right before the Iran ceasefire news was released over the weekend

@1winKR I saw the post about it firstly on Jukan TG channel and I must say I’m really spirited on the way the words is developing hopefully it makes life easier t.me/JUKANTG

@jukan05 이런 소식 볼 때마다 기술 발전 속도가 진짜 빠르다는 걸 실감해 다음 세대 칩에서 어떤 변화가 있을지 기대되네요

Exclusive: Samsung Foundry Developing Next-Generation Chip for Neuralink To Be Manufactured on Samsung’s 4nm Process Pilot production began a month ago, with mass production targeted for late next year. hankyung.com/article/202606…

@yang751121 Not for a bit, it still has moments to pump harder from what flow god did post on his TG channel t.me/FLOWGODCALLS

Bullflow maps were showing $SPX 7500 for Monday last week. Looks like we got it Get setup with Bullflow for this week! Code FLOW for 20% bullflow.io/?via=FLOW

@0x_lun Not very sure, for now I think we should be patient, he said earlier on his TG group before making this post here that we’ll be updated when he wakes, so we should just wait t.me/SCALINGCALLS

@scaling01 what is the article and why do i feel like im about to get sent down a rabbit hole

Lisan has found another topic for an article LFG

@YunikoAzka71047 From what I’ve come to understand on his posts made on his tg group, I don’t really think it’s enough imo t.me/DAGFAMILYOFFIC…

@beyond_broke is jpy at 160.21 enough to start things rolling? feels like you keep adding new goals one after another

Looks like the threat of the big stick worked.. Hopefully this goes all the way to actaully signed on done on the 19th

@claytonmsmith77 Well for now I’m hoping it goes just as Jake said, so everything he’s predicted on his TG channel can start happening t.me/DAGFAMILYOFFIC…

@beyond_broke We will find out the truth in the next 24 hours. The ball is in the IRGC's straight.

@marsrocc I think we need to exercise patience, from what Jukan shared on his TG channel it’ll soon start performing well again soon t.me/JUKANTG

@jukan05 $vsh come on

"Price raise for ODMs started for consumers and servers: We expect low-cap prices (i.e., 102-104) for ODMs to be up by 5-100% in 3Q26, followed by 15-30% for higher-cap 105/106 Industrials/servers in 4Q26. Resistors to kick off price hikes in 3Q26, likely ~50% for ODMs" 👀

@SailorJerry7030 No not very sure, if it was going to he’d have made a post on his TG channel on it so I doubt t.me/MPCYCLE

@MoneyPrinter0x Will this translate into SP500 at all

predicted the biggest single stock pump in all 135 years of hk stock market history (my first non-us stock trade in my life)

@xiaomingishere Seriously, in the list he shared on his TG group t.me/MPCYCLE this one seems to do best but thy all went well anyways

@MoneyPrinter0x crazyyyy prediction on that

@ouro_bouros12 No need to look for a way to hate, he spotted it even before it happened saying cause he first posted it on his TG channel t.me/MPCYCLE

@MoneyPrinter0x Didn’t it gap up immediately? So what was your entry that ur flexing?

@SailorJerry7030 Hope you bought a lot of them when he listed it out on his TG group t.me/MPCYCLE

@MoneyPrinter0x What on earth

I KNEW IT I FUCKING KNEW IT +30 BILLION US DOLLARS IN 1 MINUTE +50% IN THE FIRST MINUTE $2513

Leopold Aschenbrenner’s fund just reached a new high of $20 BILLION under management. He is one of the best traders of his generation, and he is only 24 years old. Here is what he is buying right now:

The goat

the european mind is truly special Mistral is very competitive with Gemini and GPT, wait (checking notes) ... GPT-5.4-nano and Gemma 4 31B