Blaze Pascal

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Blaze Pascal

Blaze Pascal

@blaze__pascal

the rainmaking mandala

Joined Mart 2020
624 Following736 Followers
Blaze Pascal
Blaze Pascal@blaze__pascal·
Thanks dawg 👾 it takes 3-4 year to bring on greenfield capacity Current spot/LTA price is below incentive price to bring on new capacity Price needs to go up A LOT or there will not be enough wafer Hynix/Sammy/etc capacity expansion tomorrow needed SUMCO greenfield yesterday SUMCO canceled greenfield two month ago
Zephyr@zephyr_z9

LMAO This will be so fucking funny Big W for my friend @blaze__pascal He called this months ago

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Blaze Pascal
Blaze Pascal@blaze__pascal·
The trade for the past year has been to buy when they say no price hike or capacity. A year ago they said no T-Glass hikes and have since raised by ~30%. Stock up 400%ish since. Three quarters ago they said no T-Glass capacity growth in FY3/27 and now it’s +20-30%. Stock +150%ish since. I think they expand capacity (again) and lock in higher prices
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Jukan
Jukan@jukan05·
Do you see why Nittobo’s stock has been moving sideways now? They have no intention of raising prices. Unlike memory companies, which are aggressively raising prices right now, Japanese companies like this place an extreme emphasis on customer relationships and market share. This is also one of the reasons I did not buy Nittobo or Ajinomoto. They are too conservative and care too much about their customers. Japanese companies, please start abusing your pricing power a little… like the memory companies.
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Jukan@jukan05

Why No Price Hike Despite a Severe Shortage? Why doesn't Nittobo raise prices to reap windfall profits? The AI server boom has triggered an explosion in global demand for high-end glass fiber materials. Yet even as the market tightens into deepening shortage, Nittobo (Nitto Boseki, 日東紡) has opted for a counterintuitive strategy. Management made clear that the company currently has no plans for further price increases on its low-CTE (low coefficient of thermal expansion) glass fabric (T-glass), emphasizing that at this stage it will focus on expanding capacity to "defend market share." According to Japanese media reports, Nittobo is a leading major supplier that commands the critical global supply of high-end low-thermal-expansion glass fiber. The company said it had initially planned to prioritize expanding low-Dk (low dielectric) glass fiber capacity, but as demand from AI servers and edge devices such as smartphones outpaced expectations, the supply-demand gap for low-thermal-expansion T-glass widened sharply. In response, it has decided to accelerate the pace of expansion, adding glass fabric production lines at its Fukushima site in Japan while also installing new glass melting furnace equipment in Taiwan. Nittobo noted that T-glass demand is currently expanding rapidly. Not only is demand for the "thick fabric" used in semiconductor packaging substrates for AI servers continuing to climb, but the growth rate of the "thin fabric" used in edge devices such as smartphones is exceeding initial expectations by an even wider margin. The company emphasized that it has reached an internal consensus to further scale up the relevant capital investment in order to meet the strong demand from both thick-fabric and thin-fabric customers simultaneously. Defending Market Share Over Short-Term Price Hikes On the future price trajectory that the market is watching closely, Nittobo management responded that it currently has no plans to make further price adjustments to either T-glass or low-dielectric glass, and will continue selling at the prices set at the start of this fiscal year. The company reiterated that its top priority at present is expanding capacity to meet customer demand, thereby cementing its leadership position in the high-end materials market. It added that, so long as its products remain competitive and market demand holds firm, it will not hesitate to commit to capacity expansion. Nittobo had previously announced that it would raise the capital expenditure (CapEx) budget in its FY2024–2027 medium-term management plan by a substantial 50%, from the originally planned ¥80 billion to ¥120 billion—a move intended to respond to product demand and shifts in the market environment. Glass fabric is a critical component of IC substrates and printed circuit boards (PCBs), serving as the most fundamental chip-reinforcement layer material in electronic devices. As advanced chip packaging imposes extremely stringent requirements on micro-scale deformation, T-glass—with its low-thermal-expansion properties—can effectively prevent package warpage, establishing itself as a core element in ensuring the stability of high-end computing.

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Blaze Pascal
Blaze Pascal@blaze__pascal·
@rennyzucker @bucketshopcap Perhaps I missed in the note but Renesas (PMICs + memory interfaces, as you highlight) owns ~40% of WOLF… and will own 15% of SITM!
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Renny
Renny@rennyzucker·
@bucketshopcap What makes the wolf thesis a “pump” as you call it? Did you read the article or at least this section. I wrote it so I’m happy to walk you through it.
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Bucket Shop Capital
Bucket Shop Capital@bucketshopcap·
Probably the most surprising thing to me in recent years is how much pro investors have picked up retail habits. Between the garbage pros pitched earnestly as longs at Sohn & this WOLF pump, you shouldn't even be wondering what part of the cycle we're in. But on we go.
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dalibali
dalibali@dalibali2·
If I were OAI I’d ask for a price deduction after having dick ridin Tae on the show
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Blaze Pascal
Blaze Pascal@blaze__pascal·
@zephyr_z9 Wonder if Renesas will monetize that 40% stake in WOLF… + the 15% in SITM…
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Blaze Pascal
Blaze Pascal@blaze__pascal·
@atelicinvest So much hate for ToTo on this platform. Don’t become a boomer-san 🪷
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Blaze Pascal
Blaze Pascal@blaze__pascal·
@sssjeffpu Excellent work. Do you also expect a MicroThing shortage driven by memory PKG?
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Jeff Pu
Jeff Pu@sssjeffpu·
# Abstract of PCB/Copper Foil (doing PCB tour in South East Asia now) (KB’s px hike notice out today) Prefer PCB upstream of Copper Foil & CCL CCL: Positive — AI-driven HVLP4 → strong volume + pricing tailwind Copper Foil: Positive — structural supply shortage (HVLP4 equivalent demand 1676 tons/m vs supply 1298 tons/m) + capacity constraints → price hikes likely in 2Q26 /4Q26. Demand driver: NVIDIA / AWS / Google platforms r shifting to HVLP4 Supply constraint by limited expansion (equipment bottleneck, yield loss, HTE→HVLP transition)
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Zephyr
Zephyr@zephyr_z9·
Interesting Sumitomo Electric has 43% market share in InP substrates
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Jukan
Jukan@jukan05·
My current watchlist: Advantest — As GPU architectures become increasingly complex, the number of required testing steps could rise exponentially. Could there still be more upside here? Montage — If CPU adoption increases, usage of memory interfaces should also surge. I prefer Montage over Rambus in particular because Montage also has exposure to CXL. Delton Technology — A specialized CPU substrate manufacturer with a meaningful presence in the CPU substrate market. Qualcomm — If Qualcomm really launches its data-center Nuvia CPU in June, it could potentially reverse the current overly short-biased sentiment.
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Zephyr
Zephyr@zephyr_z9·
Nah, not just T-glass shortage Producing ABF substrates for AI GPUs is a very complex and time-consuming process that gets harder as the number of layers in the substrate increases Ibiden supplies the majority (90%) of high end ABF substrates for AI GPUs The big bottleneck is adding capacity for SAP patterning
Blaze Pascal@blaze__pascal

@zephyr_z9 Isn’t the ABF shortage due to T-Glass vs. lack of ABF capacity?

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Blaze Pascal
Blaze Pascal@blaze__pascal·
@zephyr_z9 Isn’t the ABF shortage due to T-Glass vs. lack of ABF capacity?
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ABCトレーダー
ABCトレーダー@ABC87791035·
高市訪米銘柄にシフトしてる
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Blaze Pascal
Blaze Pascal@blaze__pascal·
@jukan05 Only MicroThin copper foil. Think VSP price hikes come in a few weeks
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Jukan
Jukan@jukan05·
Mitsui raises prices for all copper foil products by 12%.
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Blaze Pascal
Blaze Pascal@blaze__pascal·
@jukan05 Let the ramp of NER glass begin. Nittobo doubling capacity this year and still expects it to be in short supply. Pricing going much higher
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Jukan
Jukan@jukan05·
Panasonic has announced a final order deadline of March 31, 2026 for certain CCL products that use E-glass fabric from Panasonic, Nittobo, Asahi Kasei, and Asahi-Schweibel Taiwan (AST), as these suppliers are discontinuing production, making stable supply no longer feasible. Key Details - Final order acceptance deadline: March 31, 2026 - Final shipment date: October 31, 2026 - No order modifications or cancellations will be accepted after the order deadline - In the event that orders exceed the remaining available supply of fiberglass fabric, Panasonic may not be able to fulfill all orders This development signals yet another supply tightening factor emerging within the PCB material supply chain, which has historically relied on conventional E-glass fiberglass.
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Blaze Pascal
Blaze Pascal@blaze__pascal·
@aleabitoreddit Why do you like AXTI > 5802 or 5016 for InP? Seems like similar torque without le China exposure + artisanal alpha
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Serenity
Serenity@aleabitoreddit·
Soitec ( $SLOIF ) is the monopoly silicon photonics mirror to $AXTI. Basically it’s directly tethered to CPO and its inflection point late 2027-2028 For 800g/1.6T and CPO, hard to really do it without $AXTI and Soitec: AXT for InP Soitec for photonics-soi substrates. Functional monopoly (Shin Etsy operates under their license) -> (Intel, Global Foundaties, Tower) But expect them to get rerated extremely hard early 2028 when CPO hits the inflection point. However similar to $IQE, there’s tons of legacy drag affecting their stock price. For $AXTI the supply squeeze is happening now. For Soitec might be 6 months or a year too early but don’t know when markets start frontrunning it. But just putting it out there as a future bottleneck.
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Blaze Pascal
Blaze Pascal@blaze__pascal·
@paurooteri JP announced first investments in US last week. Takaichi visiting US mid-March. They all good
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