
20250609
399 posts





The fastest way to turn into a NPC is to fill every moment of stillness with audio books, podcasts, CEO interviews, tweets, threads, and YouTube videos. The fastest way to turn into the Main Character is to spend more time in stillness and give yourself 4 hours to create.





$MU looks like the next Nvidia. When Nvidia was $400B (now $4.5T+), markets thought GPUs were a short-term cycle. Same with memory today. AI has broken that cycle. With the same "Made in America" and White House backing like $INTC: Don't overthink things with Micron.

@Ryandally08 Not wrong Churchill once said: "Anyone who was not a liberal at 20 years of age had no heart, while anyone who was still a liberal at 40 had no head."



There have only been a couple of times in my life when I entrusted others to manage my money—mostly early on, when I was inexperienced looking for guidance and looking for someone to get me rich. In hindsight, I’m actually grateful for those lessons. They forced me to take full control of my financial future. What I learned from those mistakes ultimately made me thousands of times what I lost. But not long ago, I made a similar mistake. I placed trust in @loukerner to be both a friend and competent in a space I was exploring. While crypto performed exceptionally well (tripling in price), the results from the SPAC he pitched were quite the opposite to the tune of an 85% loss. Fortunately, the investment was a tiny test position simply because we were "friends." Unfortunately, not everyone I know was as cautious. 99.999% of my money is managed personally—and that’s exactly how I like it: in the best hands I know… my own. My suggestion to you is: learn how to invest and self-direct your capital. Why? Because no one cares about your money or your future like you do.

我自己整理的台股/美股 半導體瓶頸 有需要就存入書籤!! L1 — 材料層 高功率、窄線寬雷射 3105 穩懋 (WIN):InP 基板,衛星通訊/激光雷達核心,中國管制後需求放大 4-6 倍 COHR Coherent:雷射元件,光通訊/資料中心 LITE Lumentum:光通訊雷射,3D 感測 玻璃核心基板 GLW 康寧:TGV 玻璃通孔技術,先進封裝核心材料,全球 60%+ 市佔 ABF 基板 3105 穩懋:台灣 ABF 載板供應鏈 3037 欣興 Unimicron:ABF 基板,AI 晶片封裝 3189 景碩 Kinsus:ABF 基板 先進 PCB 4958 臻鼎 Zhen Ding:高密度互連 PCB Compeq /敬鵬:車用/AI PCB ——— L2 — 電力層 800V 電力傳輸 / 電源架與匯流排 2308 台達電 Delta:寬溫電源(-40°C~85°C)、SST 固態變壓器、電源機架 1519 華城:電力變壓器、軍工基地電網 VRT Vertiv:數據中心電源+散熱整合 ETN Eaton:電力管理,800V 架構 MLCC Yageo 國巨:全球前三,AI 伺服器需求 電感器 奇力新 Chilisin:AI 電源模組 2308 台達電:電感器/電源模組 電網變壓器 1519 華城:AI 數據中心電網擴容 2308 台達電:固態變壓器,效率 98.5% 燃氣渦輪機 GE Vernova (GEV):數據中心備用發電 Siemens Energy:燃氣渦輪機 ——— L3 — 散熱層 熱管理與液冷系統 3017 奇鋐:邊緣設備散熱,功率密度 1.5 倍 3324 雙鴻:散熱 Cooler Master 訊凱:液冷散熱模組 VRT Vertiv:液冷整體方案 ——— L4 — 記憶體層 HBM 與先進記憶體 MU Micron:HBM3E 綁定 NVIDIA,1γ 節點,DDR4 毛利率 67.9% 2408 南亞科:DDR4 供給缺口,投信大力買超 2344 華邦電:NOR Flash/DRAM,利基型記憶體 6770 力積 PSMC:DRAM 設計 SK Hynix:HBM 全球第一 ——— L5 — 連接層 矽光子學 ALAB Astera Labs:CXL 互連晶片,記憶體池化 LITE Lumentum:光通訊元件,矽光子 COHR Coherent:光收發模組 Intel:矽光子收發器 高速 SerDes CRDO Credo:高速 SerDes MRVL Marvell:高速互連晶片 ——— L6 — 封裝層 先進封裝 2330 台積電 TSM:CoWoS 壟斷 3443 創意電子 GUC:AI 芯片 ASIC 設計 6643 M31:軍工芯片 PHY/高速接口 IP 混合鍵合 2330 台積電:SoIC 混合鍵合技術 ASML:混合鍵合設備 BESI:混合鍵合設備 ——— L7 — 管理層 BMC 晶片 5274 信驊 Aspeed:BMC 壟斷,伺服器 ——— L8 — 雲端 CapEx 雲端基礎設施 ORCL Oracle:IL6 認證唯一, AMZN AWS:雲端市佔 31% MSFT Azure:雲端市佔 22% GOOGL Google Cloud:雲端市佔 11% ——— 額外補充核心 AI 大腦(對應半導體核心) NVDA:AI GPU 絕對核心,CUDA 生態 AMD / AVGO:第二算力 + 網絡 ASIC ARM / INTC / GFS / UMC:架構與成熟製程


We have only just entered the early innings.








