ImNotHarsh | 📈💸

$INTC Intel bullish case 🐂 for FY25 and FY26. The potential for growth in Intel’s stock, catalyzed by the foundry network enhancement / investment in manufacturing capacity, presents an undervalued opportunity for substantial market capitalization expansion. This growth potential, estimated to increase Intel’s market capitalization by at least 30%, is further bolstered by the regulatory policy changes anticipated by the Trump administration next year. Year-over-year earnings growth anticipated to surpass 200% due to the company’s substantial production plans, the conclusion of its high-investment phase, and the implementation of in-house manufacturing strategies that will lead to cost reductions. (source: Forbes)

We – design the chips & hardware – make the cars w/ said hardware – collect real-world data at scale – train the real-world AI model – built (& continue to expand) the massive supercomputer cluster that trains it – deploy AI directly to millions of robots on wheels All that is shared with @Tesla_Optimus for broader applications in both the physical & digital world

$INTC is now firmly planted in the $NVDA #AI eco system from the looks of it. Not just products but IFS too.

Intel to Raise PC CPU Prices by 10%, Adding to PC Manufacturers’ Cost Burden Intel plans to raise prices on its PC central processing units (CPUs) by 10%. With profitability already under pressure from soaring memory semiconductor prices, the upcoming increase in CPU prices — another core component — is expected to further weigh on PC manufacturers’ production costs. According to industry sources on the 19th, Intel has notified major customers that it intends to raise PC CPU prices by the end of this month. The price hike is said to cover most of the key products across Intel’s diverse CPU lineup. The move is seen as Intel’s effort to protect margins amid a supply-demand imbalance, as surging demand for AI data center semiconductors has reduced the supply available for consumer products. The CPU, which serves as the brain of a PC and determines processing speed and performance, is a critical component. Intel holds approximately 70% of the PC CPU market. While AMD and Qualcomm are also expanding their PC CPU supply, Intel’s dominance remains overwhelming. Against this backdrop, Intel’s price hike is particularly damaging to PC manufacturers, as rising production costs will sharply deteriorate their profitability. Memory prices — another essential PC component alongside CPUs — are also seeing unprecedented surges, driven by memory supply shortages stemming from expanded AI infrastructure investment. According to market research firm Counterpoint Research, memory prices rose by as much as 180% quarter-over-quarter in Q1. PC manufacturers are now on high alert as prices for essential components spike. An industry official noted, “The biggest concern for manufacturers right now is the rapidly rising cost of components. There are fears that if Intel CPU prices rise on top of everything else, operating profits will fall sharply and companies will struggle to stay afloat.” Major PC makers are responding to the crisis by diversifying their supply chains and increasing the proportion of higher-value AI PCs in their product mix — a strategy aimed at defending profitability through greater sales of premium products. However, since memory prices are expected to remain elevated through next year, PC manufacturers’ difficulties are likely to deepen further. Rising component costs are also expected to feed through into higher PC retail prices, increasing the burden on consumers. Separately, market research firm TrendForce projected that if memory and CPU prices rise simultaneously, the combined share of these two components in notebook BOM (bill of materials) costs could reach as high as 58%. It added that memory price increases alone could push retail prices for standard laptops up by more than 30%, and that with the additional CPU price hike, total price increases could approach 40%.​​​​​​​​​​​​​​​​ $INTC

Secure on-prem, edge, and cloud with #IntelXeon 6. Intel confidential computing solutions help safeguard your data without slowing you down. See how security starts with silicon: ms.spr.ly/6017QUmZX #NVIDIAGTC

@beefcubee Ahhh interesting ty for the catch Let me read into this

@imnotharsh this is for NVIDIA DGX™ Rubin NVL8, but i'm talking about Nvidia Groq LPX. Intel didn't mention that either.

i asked chatgpt, gemini, and claude. they all say Nvidia Groq 3 LPX uses Intel Xeon CPU. $INTC $NVDA #GTC

@beefcubee Link under it This is what they were referring to basically

@imnotharsh where did Intel highlight it? I must have missed it.

@beefcubee Its def the xeon 6 that Intel highlighted themselves Sad that nvda wont call it out

@LeadingReport What happened to the 0.07% of peope?

BREAKING: Kim Jong-un has won North Korea's parliamentary elections with 99.93% of the vote.

@Turbolag12 Feels like a “im just going to make trump happy”

@imnotharsh Maybe the $5B was just a payoff so he could move forward on other roadblocks 🤷‍♂️

$INTC needs to win. Jensen is for himself and for Nvidia. Understandably. But, Intel is the US’s only hope for true IP.

Funny that $NVDA and Jensen Huang refused to mention $INTC Intel at all today. Intel Xeon 6 is being used as the Host CPU for the DGX Rubin NVL8 systems. For a company who owns a $7B stake, which represents 61% of its portfolio, I don't quite understand the point of not even highlighting where Intel falls into place in the grand scheme.

We’re proud to share that @Intel's Arizona Fab 52 construction project has been named Engineering News‑Record’s 2025 U.S. Project of the Year, along with receiving the Excellence in Safety award. Fab 52 is now ramping leading‑edge logic technology researched, developed, and manufactured in Oregon and Arizona, strengthening U.S. leadership in semiconductor innovation and advanced manufacturing for decades to come.  enr.com/articles/62647…

Together, we’re driving the next wave of AI infrastructure and innovation. Learn more: ms.spr.ly/6011Qowal @nvidia #NVIDIA

@StockStormX Not sure I agree with this, but I see your point Remains to be seen what this partnership truly entails

@imnotharsh when jensen doesnt say a name on stage its almost a louder message than when he does

@MajorOcelot45 This is Intel’s blog site - only because Intel mentioned it, we know that there is even a semblance of partnership

@imnotharsh newsroom.intel.com/data-center/in…

@Anoldoldwooden This is interesting, will have to read a bit more into this - still surprising to me Intel has to be the one highlighting the integrated use cases

@imnotharsh Not sure if this increases the use cases for the NVL8 meaningfully or any kind of IP situation with codevelopment community.intel.com/t5/Blogs/Tech-…

Intel’s foundry bet: to supply ‘large-area AI chip packaging’ this year Intel is set to introduce advanced packaging technology capable of manufacturing large-area artificial intelligence (AI) semiconductor chips. The move is seen as a major bet to strengthen its semiconductor foundry business and challenge rivals TSMC and Samsung Electronics, which currently lead the market. According to industry sources on the 16th, Intel will significantly upgrade its AI semiconductor chip packaging technology this year to reinforce its foundry capabilities. The company has been preparing for this since last year by establishing a related technology roadmap. The key focus is “large-area” AI semiconductor packaging technology. Specifically, Intel plans to supply packages measuring 120×120 mm. At present, most AI semiconductor chip packages are around 100×100 mm in size. Even NVIDIA’s latest AI chip, Blackwell, uses that package size. As chip packages become larger, more computing units such as GPUs and CPUs, as well as more memory, can be integrated. In particular, there is more space to place high-bandwidth memory (HBM), which is regarded as critical memory for AI. This can significantly boost the performance of AI semiconductor chips. However, increasing package size also raises the level of manufacturing difficulty, including issues such as warpage and lower yields. That is why highly advanced technology is required to scale up package size. Intel plans to mount at least 12 HBM stacks on its 120×120 mm package. By comparison, a 100×100 mm package typically accommodates 8 HBM stacks. Intel does not plan to stop there: by 2028, it aims to introduce an even larger 120×180 mm package, designed to provide enough space for up to 24 HBM stacks. An Intel Foundry official said, “The market is currently looking for AI semiconductor chip packages larger than 120×120 mm. Considering the expansion of AI, package sizes will eventually grow to 250×250 mm in the long term, and we will continue expanding package sizes accordingly.” Intel’s proprietary packaging technology, EMIB (Embedded Multi-die Interconnect Bridge), is also central to strengthening its foundry competitiveness. EMIB connects different semiconductors inside a package using a silicon bridge embedded in the substrate. Last year, Intel unveiled EMIB-T, which applies TSV (Through-Silicon Via) technology to EMIB. It is understood that Intel is preparing an EMIB-T structure suitable for HBM4, which memory makers are currently pushing toward mass production. The new structure is said to focus on providing stable power delivery to AI semiconductor chips. Intel’s move is part of a broader strategy to turn around its position in the foundry market. Demand for outsourced production of AI semiconductor chips — a core infrastructure component in the AI boom — has been rising sharply, but Intel still trails behind TSMC and Samsung Electronics. To close that gap, the company is making a stronger push into advanced packaging. An industry official said, “Intel has mostly applied its advanced process technologies to its own semiconductor chips, but in order to expand its foundry business, it is now actively opening them up to external customers as well. Its strategy is to capture customer demand through a variety of package sizes and packaging technologies.” $INTC

@beefcubee have my doubts that Nvidia or Jensen are going to give Intel any semblance of opportunities Intel will have to create its own path and ensure they work with major hyperscalers

@imnotharsh i do hope INTC can help fab Vera CPU but Vera and Xeon are competing

if this is their only partnership out of this GTC, it's gonna be the lamest partnership and literally nothing new. NVL8 is a lame product.

@PbNmlGfEgQVHywE i dont provide financial advice - that said, i am personally very bullish outside of this Nvidia partnership alone - i just dont think this stake or partnership is really going to amount to anything for some time, if that makes sense

@imnotharsh Wow.this makes me wanna pull out...

BREAKING: $INTC Intel Xeon 6 used as Host CPUs in $NVDA NVIDIA DGX Rubin NVL8 Systems Today at NVIDIA GTC 2026, Intel announced that Intel Xeon 6 is being used as the processor for NVIDIA DGX Rubin NVL8 systems. This highlights Xeon’s role in providing architectural continuity and scalability for GPU-accelerated AI systems as workloads shift toward massive, real-time inference. NVIDIA DGX Rubin NVL8 systems integrate Intel Xeon 6 processors, building on the architectural foundation established with Intel Xeon 6776P in current NVIDIA Blackwell-based platforms, including DGX B300 systems. By building on this proven foundation, Intel is helping to carry forward the performance, experience, and system-level expertise into the new DGX Rubin NVL8 systems. Intel engineered Xeon to help these systems get the most out of their GPUs, using features like Priority Core Turbo to keep data flowing to GPUs – and with strong single‑thread performance handling orchestration, scheduling, and data movement, Xeon helps ensure everything runs smoothly and efficiently even as inference workloads grow more complex.

@PbNmlGfEgQVHywE i don't think it's valuable at all tbh. extremely disappointed the stock is definitely manipulated, no doubt. i am more concerned now with Intel Foundry advancements. seemingly, intel will never will in the eyes of the market.

@imnotharsh What do you make of this news? How valuable is this for intc and what can it tell us on the speed of lbt? Also is today intc stock movement a real or manipulated one?