
UBS: NVIDIA may offer two SKUs for Rubin Ultra: a 2-chip version and a 4-chip version. The 4-chip version will likely use Intel’s EMIB-T. $INTC
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@Investor2212
Investing for my future. Not Financial Advice

UBS: NVIDIA may offer two SKUs for Rubin Ultra: a 2-chip version and a 4-chip version. The 4-chip version will likely use Intel’s EMIB-T. $INTC



$IGV Software is about to go on a massive rally...and Microsoft will lead that. IGV's current Top 3 holdings in order: 1. $MSFT, 2. $ORCL, $PLTR. Friday's close was above a major fib rejection level of $90.73 (61.8%). It has already broken out from a major resistance line at $88. It double topped and still stayed within range until finally broke out over the last 2 days. Zooming out, the weekly shows you the story. $95 next week, with a breakout into $100 by May 22nd, but probably shows a push next week into that range. With Microsoft the #1 holding, showing a similar pattern to IGV. Both on the verge of a major upswing.










Today's Darkpool Breakdown ~$35.1B - Total Dark Pool Premium $MSFT saw the highest with $3.2B 🔥 $SPY $QQQ

OpenAI reportedly capped $MSFT total revenue share at $38B under its revised deal. That could give OpenAI more flexibility to work with $AMZN and $GOOGL as it builds toward a potential IPO.

I didn’t realize this, but it looks like AWS may be using EMIB for a lower-end version of Trainium through MediaTek. Similar to the TPU v9 program handled by MediaTek, next-generation Trainium seems likely to use both EMIB and CoWoS. $INTC


Interesting. Tesla’s current AI5 chip, codenamed Helios, is reportedly being foundried by TSMC and Samsung, and the next-generation AI6 was also originally expected to be split between those two foundries. However, under strong pressure and encouragement from the Trump administration, the portion of AI6 that was originally assigned to TSMC will reportedly be transferred entirely to Intel Foundry. $INTC


NEWS: SK Hynix is reportedly in R&D with $INTC Intel on 2.5D packaging, specifically testing Intel’s EMIB technology to integrate HBM memory with logic chips for AI accelerators. EMIB serves as an alternative to TSM’s CoWoS, potentially allowing SK Hynix to expand beyond memory supply into turnkey HBM solutions amid high AI demand. The collaboration bolsters Intel’s foundry packaging ambitions and fits SK Hynix’s strategy for U.S.-based 2.5D facilities to enhance supply chain resilience.

