Semiconductor Engineering

Latest: Intel teams up; GPU rowhammer attack; faster verification; Samsung’s new packaging site; China poaches Taiwan talent; thinnest GaN chiplet; AFM-IR; new edge design; BMW hydrogen; TSMC, Samsung $; silent data corruption.. semiengineering.com/chip-industry-… #semiconductor #semiEDA

New refresh commands chase Rowhammer and Rowpress, but a permanent fix remains years away. semiengineering.com/drams-whac-a-m… #DRAM #rowhammer #rowpress #hardwaresecurity

AI’s Potential And Limitations In Chip Design semiengineering.com/ais-potential-… SE's Ed Sperling talked with 6 industry experts about the opportunities and challenges of using AI in chip design. Panelists: @Synopsys @intel @Microsoft @nvidia @AMD @UCBerkeley

Special Report: AI Accelerators Usher In New Era Of Semiconductor Test semiengineering.com/ai-accelerator… The number & variety of test interfaces, along with more packaging complexity, are creating an explosion of testing challenges #semiconductor #semiconductortest #HBM #AIAccelerators

Why smarter charging, battery management, and power conversion are now the real differentiators in EVs and edge systems. semiengineering.com/moving-electro…

Latest: Tighter restrictions on DUV litho; Arm-IBM dual-architecture; power device trio; Irish fab; 1.4nm AI chip; heat islands; 2nm & below; 300mm fab equipment; 67k IC jobs; HBF wins; photonic chip packaging..semiengineering.com/chip-industry-… #semiconductor #semiEDA #photonics #MATCHAct

Special Report: Scaling logic continues to deliver better performance per watt, but it’s becoming harder, more expensive, and increasingly customized. semiengineering.com/challenges-in-… #2nm #semiconductor #hybridbonding #3DIC #GAAfets

With SRAM failing to scale in recent process nodes, the industry must assess its impact on all forms of computing. There are no easy solutions on the horizon. semiengineering.com/memory-wall-ge… #SRAM #memorywall

Special Report: Whether caused by cosmic radiation, voltage glitches, or adversarial attacks, bit flips threaten data integrity, safety critical operation, and the foundations of hardware security semiengineering.com/the-one-bit-pr… #semiconductor #hardwaresecurity #bitflip #rowhammer #DRAM

High-speed data movement will be required in future vehicles, probably including optical, but challenges persist. semiengineering.com/auto-ethernet-… #AutomotiveEthernet #Ethernet #automotive

Data Boom Puts Pressure On NoCs, Fabrics: New adaptive, mesh NoC topologies are enabling chip designers to optimize data movement in complex SoCs and multi-die systems. semiengineering.com/data-boom-puts… #NoC #networkonchip #chiplets #semiEDA #NIUs #semiconductor

Chip Industry Week In Review semiengineering.com/chip-industry-… Arm’s game-changer; QC break year; GF sues Tower; new fabs; helium atom beam litho; AI tool $; 90% less GenAI cost; 2D roadmap; Intel’s security report; imec's silicon photonics; PQC challenges; memory for AI at the edge...

New technical papers recently added to Semiconductor Engineering’s library: semiengineering.com/chip-industry-… #semiconductor #hybridbonding #neuromorphic #3DDRAM #chips #interconnects #digitaltwins @GeorgiaTech @ETH_en @BoschGlobal @UCSanDiego @RWTH @UCLA @RutherfordApLab #radhard

Special Report: Thermal management is the biggest performance and reliability bottleneck in multi-die assemblies. semiengineering.com/beating-the-he… #semiconductor #3DIC #warpage #thermalmanagement #heat #STCO

Latest: US AI framework; GPU smuggling; HBM4; war’s impact on supply chain; GTC; restart of H200; memory prediction; TFLN photonics; test/metrology platforms; NoC verification automation; AI distillation attacks; high-NA EUV... semiengineering.com/chip-industry-… #semiconductor #GPUs #AI

Chips that didn’t need cooling may require it now. semiengineering.com/liquid-cooling… #semiconductor #liquidcooling #heatsinks #immersioncooling #microcooling