Sandy
41 posts



Is SMIC N+3’s Metal Pitch Smaller than Intel 18A’s? SMIC N+3 Node Deep Dive vs TSMC N6, TechInsights Private Equity Sale, SemiAnalysis Teardown Engineering & Evaluation Lab, HiSilicon Kirin 9030, Process Technology, Pattering, Cell Architecture newsletter.semianalysis.com/p/steel-smic-n…



I wrote an article on why China got rich and India didn't, and why investing in human capital is so important for poor countries to succeed



你们要的华为近封装光学模块来了。单向8T的NPO模块,用Nvidia的标准那就是双向16T,用华为的新名词就是Hi-ONE近封装光学。 一个昇腾960对应一个NPO模块。时间节点在2028年。 DSP将被绕开,之前,DSP的大部分市场份额很长时间内被博通和Marvell占据。

Anthropic 的老板Dario 看来当年没少在中国花啊~ 不知道遭遇了啥如此的痛很国人……









Nothing that Huawei has presented was groundbreaking to those truly familiar with semiconductors; even the LogicFolding strategy is not really big news. In fact, DARPA has been testing this strategy since 2017 in the FRANC program. top500.org/news/darpa-pic…





Jensen was right.


Huawei's latest announcement carries real significance, because China has, in effect, shown the direction in which advanced technology needs to move. And it has done so in cutting-edge semiconductors, no less. China has long been a follower. In semiconductors, Western technology played the role of the pioneer, while China was preoccupied with simply keeping pace. But by banning EUV exports to China, the U.S. manufactured a bottleneck at the lithography tool — and in doing so, it effectively forced creativity onto China. To circumvent the sanctions, China was pushed toward approaches the West had never needed to take. That is exactly what today's announcement represents. Where Nvidia co-designs memory, packaging, and logic to optimize TCO at the system level — doing it rack by rack — Huawei is doing the same thing at the chip level. I'll say it again: this is a genuinely striking approach. Memory makers are already struggling with cost scaling. As linewidths shrink, the resources required to keep shrinking them — capital, manpower, time — are climbing exponentially. So the day will come when the West, too, must make packaging, logic, and memory collaborate from the node-design stage. And it won't be far off. China, through the paradox of sanctions, has been driven to do this ahead of the West — unintentionally. This is what genuinely frightens me. As YMTC has already demonstrated, U.S. sanctions pushed China to skip the incumbent standard and jump straight to the next-generation one. The result? YMTC carved out a meaningful presence in hybrid bonding — and even Samsung, the king of NAND, ended up licensing YMTC's patents. I believe the West may well find itself licensing this Huawei technology a few years down the road. And I believe cases like these will multiply, spreading China-style standards in their wake.



@zephyr_z9 Foveros Direct 3D relabeled

华为:今年秋季面世的麒麟手机芯片性能将大幅提升。 华为公司董事、半导体业务部总裁何庭波在题为《半导体新路径探索与实践》的主旨演讲中,正式发表“韬(τ)定律”。这是中国在全球半导体领域首次提出指导产业发展的新原则。基于该定律,华为过去六年已成功设计并量产了381款芯片。今年秋季,华为将发布新的麒麟手机芯片,完整采用逻辑折叠技术,大幅提升相关性能。


“When I was 20-21 in NYC I was single and ready to fuck” Now she wants to settle down.
















