Micro2Macr0
193.2K posts

Micro2Macr0
@Micro2Macr0
Macro Economist - Self-made multimillionaire - Formerly Retired at 42 - Always trying to find companies and investments that are solving tomorrows problems





$Oil still getting REJECTED – Bullish For Stocks & #Bitcoin!




This is an insane looking street takeover on Lower Wacker.


$MU Bargain of the Century PE Ratio: 15.5 Sales Ratio: 2.33 50% Increase in HBM (AI Memory) Sequentially. DRAM/NAND prices are surging.


$TSM $ASX $AMKR $INTC Steady Rise of Advanced Packaging TSMC’s CoWoS wafer ASP has reached ~$10,000, positioning advanced packaging as a major future profit driver. High-value packaging: CoWoS ASP now rivals advanced logic nodes due to explosive AI demand, making it one of the most supply-constrained resources in the AI chip ecosystem. Strong margins potential: Lower capex (no expensive EUV tools needed) supports gross margins that could match front-end processes. Margins are currently below TSMC’s company average but are expected to rise significantly with scale. Revenue contribution: Advanced packaging accounted for ~10% of TSMC’s revenue in 2025 and is projected to grow further with surging AI needs. Capacity expansion: Expected to reach ~1.3 million units in 2026 and ~2 million in 2027. Overall advanced packaging capacity is forecast to grow ~80% from 2022–2027. Strongly bullish implications for both $AMKR (Amkor Technology) and $ASX (ASE Technology) as TSMC’s CoWoS capacity crunch drives outsourcing of advanced packaging work amid exploding AI demand. Direct TSMC outsourcing winner: Amkor is already receiving transferred CoWoS orders and has a formal TSMC partnership (MOU) to deliver CoWoS and InFO packaging/test services out of its new Peoria, Arizona facility. This aligns perfectly with TSMC’s U.S. expansion push. Largest OSAT beneficiary: ASE expects advanced packaging (LEAP) revenue to double to $3.2B in 2026, driven by TSMC overflow on NVIDIA GPUs, AMD CPUs, Amazon Trainium ASICs, and more. It has full CoWoS-like solutions (CoWoP, FoCoS) and is ramping panel-level packaging. Pricing power: Planning 5–20% price hikes in 2026 due to tight capacity and AI prioritization.

That was golden. You can see him running into the wall of realizing. 👏

~60% of American households own stocks.


HAHAHAHAHAH. Seattle residents are now building WALLS on their blocks to keep out criminals.







