
Caplume Research
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Caplume Research
@caplume_R
Just some random research













#Intel Thanks for referencing our research. We believe the company’s front end 18A yield is also doing well, which is consistent with mgmt’s comments. As said in our earlier note, we expect the company to have started trial/testing for external customers based on 18A for a customer’s 2023’s chip which was on N3B.


Intel 2030 Financial Model I know it says 2030, but we'll know Intel's 2030 capacity plans by 2028 due to design decisions and contracts. Plus, why Intel should acquire Substrate for its XRL tool as soon as possible. open.substack.com/pub/alexintel/…

And yet Intel investors keep saying $AMD won’t have enough supply/capacity to meet the insane demand…… 🤭🤭🤭 AMD’s Zen6 Venice Server CPUs are fully built on $TSM wonderful N2 process 😉 5 new fabs for 2nm means 45% more production capacity 3nm had at the same stage for AMD!!! 😱😱😱 There will be PLENTY of 2nm supply throughout the Agentic AI era to meet the rising demand folks! 😉

Citing UBS's AMD earnings preview: - The market is clearly aware that INTC's guidance reads very favorably for AMD. - This is particularly true for server CPU, given commentary implying that INTC is undershipping the market by roughly 20%. - The key question here is AMD's supply, but our field work throughout the quarter indicated that supply of INTC parts has been far more constrained than that of AMD parts. - We therefore see a very favorable setup for AMD and expect revenue to be guided up at least $1B Q/Q to the low $11B range (vs. Street consensus of ~$10.4B). - Intel's CY2026 outlook implies its Data Center & AI segment growing ~40% Y/Y, and we now see AMD server CPU growing as much as 80% this year, with units up ~40–45% and pricing up around 20%. - From a competitive standpoint, our checks remain constructive. AMD's CPU portfolio continues to compare favorably with Intel's offerings, and the lack of meaningful timeline updates for Diamond Rapids and Coral Rapids reinforces our view that AMD should maintain a competitive advantage across the x86 ecosystem through C2026. $INTC $AMD

News from @Intel and @SoftBank SAIMEMORY from @VLSI_2026 Paper T17.5 First demo of HB3DM ➡️ 9 layer, 3 micron per stack ➡️ 1 logic + 8 DRAM layers, ➡️ 13.7k TSVs/layer with hybrid bonding ➡️ 1.125 GB/layer, so 10 GB per stack ➡️ 0.25 Tb/sec/mm2 bandwidth ➡️ 171 mm2 die, so 10 GB at 5.3 TB/sec/stack VLSI is held June 14-18 in Honolulu.







相信陈爸


